A1F25M12W2-F1

ACEPACK 1 power module, fourpack topology, 1200 V, 25 mOhm typ. SiC MOSFET gen.2 with NTC

Parameters

ECCN US	EAR99
ECCN EU	NEC
Package Size	62.8 x 33.8
Packing Type	Tray
RoHs compliant	Ecopack1
Grade	Industrial
Package Name	ACEPACK 1

Description

This power module features a fourpack topology in an ACEPACK 1 module with NTC and integrates the most advanced silicon carbide MOSFETs of STMicroelectronics which are represented by the gen.2 technology. This modular solution can be used to realize complex topologies characterized by very high...
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Key features

Key features
ACEPACK 1 power module: DBC Cu-Al₂O₃-Cu based Insulation voltage UL certified of 2.5 kVrms Press-fit contact pins Fourpack topology: 1200 V SiC MOSFET R_DS(on) typical 25 mΩ Very high-power density Very low switching energies Switching characteristic almost independent from temperature Integrated NTC temperature sensor

In stock

Quantity	$ per unit	Savings
1-9	$191.76	0%
10-17	$183.66	4%
18-107	$179.59	6%
108-251	$170.81	11%
252-500	$165.63	14%
500 +	Contact sales

$191.76

Parameters

ECCN US	EAR99
ECCN EU	NEC
Package Size	62.8 x 33.8
Packing Type	Tray
RoHs compliant	Ecopack1
Grade	Industrial
Package Name	ACEPACK 1

Description

Key features

Key features
ACEPACK 1 power module: DBC Cu-Al₂O₃-Cu based Insulation voltage UL certified of 2.5 kVrms Press-fit contact pins Fourpack topology: 1200 V SiC MOSFET R_DS(on) typical 25 mΩ Very high-power density Very low switching energies Switching characteristic almost independent from temperature Integrated NTC temperature sensor