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A22H165J

Active

High-performance class-G stereo headphone amplifier

Quantity $ per Unit Savings
1 - 9$1.550%
10 - 24$1.4010%
25 - 99$1.3215%
100 - 249$1.0930%
250 - 499$1.0234%
500$0.9042%
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In stock
$1.55
Parameter NameParameter Value
Supply Voltage Min Volt2.3
Supply Voltage Max Volt4.8
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
ROHS Compliance GradeEcopack3
GradeIndustrial
Package NameCSP P 0.4 mm

The A22H165 is a class-G stereo headphone driver dedicated to high-performance audio, high power efficiency and space-constrained applications. It is based on the core technology of a low power dissipation amplifier combined with a high efficiency step-down DC-DC converter for supplying this amplifier. When powered by a battery, the internal step down DC-DC converter generates the appropriate voltage to the amplifier depending on the amplitude of the audio signal to supply the headsets. It achieves a total 2.1 mA current consumption at 100 μW output power (10 dB crest factor). THD+N is 0.02 % maximum at 1 kHz and PSRR is 100 dB at 217 Hz, which ensures a high audio quality of the device in a wide range of environments. The traditionally bulky output coupling capacitors can be removed. A dedicated common-mode sense pin removes parasitic ground noise. The A22H165 is designed to be used with an output serial resistor. It ensures unconditional stability over a wide range of capacitive loads. The A22H165 is packaged in a tiny 16-bump flip-chip package with a pitch of 400 μm.

Key features
  • Power supply range: 2.3 V to 4.8 V
  • 0.6 mA/channel quiescent current
  • 2.1 mA current consumption with 100 μW/channel (10 dB crest factor)
  • 0.006% typical THD+N at 1 kHz
  • 100 dB typical PSRR at 217 Hz
  • 100 dB of SNR A-weighted at G = 0 dB
  • Zero pop and click
  • Gain settings: 0 dB and 6 dB
  • Integrated high efficiency step-down converter
  • Low standby current: 5 μA max
  • Output-coupling capacitors removed
  • Thermal shutdown
  • Flip-chip package: 1.65 mm x 1.65 mm, 400 μm pitch, 16 bumps