Active

New

A2U8M12W3-FC

ACEPACK 2 power module, 3-level topology, based on silicon carbide Power MOSFETs 750 and 1200 V, 100 A

ECCN USEAR99
ECCN EUNEC
Package Size62.8 x 56.7
Packing TypeTray
RoHs compliantEcopack1
GradeIndustrial
Package NameACEPACK 2

This power module realizes a 3-level topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high...
Read More

Key features
  • ACEPACK 2 power module:
    • NH and NL: 750 V, 6 mΩ of typical RDS(on) each switch
    • BH and BL: 1200 V, 9.5 mΩ of typical RDS(on) each switch
    • 2.5 kVrms insulation
    • Integrated NTC temperature sensor
    • DC link capacitors between DC BUS and neutral
    • AIN DBC improved thermal performance
    • Press-fit contact pins
Coming Soon
Quantity $ per unit Savings
1-500$0.000%
Contact sales
$0.00
ECCN USEAR99
ECCN EUNEC
Package Size62.8 x 56.7
Packing TypeTray
RoHs compliantEcopack1
GradeIndustrial
Package NameACEPACK 2

This power module realizes a 3-level topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high...
Read More

Key features
  • ACEPACK 2 power module:
    • NH and NL: 750 V, 6 mΩ of typical RDS(on) each switch
    • BH and BL: 1200 V, 9.5 mΩ of typical RDS(on) each switch
    • 2.5 kVrms insulation
    • Integrated NTC temperature sensor
    • DC link capacitors between DC BUS and neutral
    • AIN DBC improved thermal performance
    • Press-fit contact pins