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ADP46075W3

Automotive-grade ACEPACK DRIVE power module, sixpack topology 750 V, 1.6 mOhm typ. SiC MOSFET gen.3 based

ECCN USEAR99
ECCN EUNEC
Package Size154.5 x 126.5
Packing TypeTray
RoHs compliantEcopack1
GradeAutomotive
Package NameACEPACK DRIVE

The ACEPACK DRIVE is a compact sixpack module optimized for hybrid and electric vehicles traction inverter. This power module features switches based on silicon carbide Power MOSFET 3rd generation, are characterized by very low RDS(on), very limited switching losses and outstanding performances in...
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Key features
  • AQG 324 qualified
  • 750 V blocking voltage
  • 1.6 mΩ of typical RDS(on)
  • Maximum operating junction temperature TJ = 175 °C
  • Very low switching energy
  • Low inductive compact design for an higher power density
  • Si3N4 AMB substrate to improve thermal performance
  • SiC Power MOSFET chip sintered to substrate for improved lifetime
  • 4.2 kV DC 1 s insulation
  • Directly liquid cooled base plate with pin-fins
  • Three integrated NTC temperature sensors
In stock
Quantity $ per unit Savings
1-9$893.690%
10-24$862.573%
25-49$857.764%
50-99$857.614%
100-249$857.564%
250-499$857.474%
500$857.434%
Contact sales
$893.69
$893.69
ECCN USEAR99
ECCN EUNEC
Package Size154.5 x 126.5
Packing TypeTray
RoHs compliantEcopack1
GradeAutomotive
Package NameACEPACK DRIVE

The ACEPACK DRIVE is a compact sixpack module optimized for hybrid and electric vehicles traction inverter. This power module features switches based on silicon carbide Power MOSFET 3rd generation, are characterized by very low RDS(on), very limited switching losses and outstanding performances in...
Read More

Key features
  • AQG 324 qualified
  • 750 V blocking voltage
  • 1.6 mΩ of typical RDS(on)
  • Maximum operating junction temperature TJ = 175 °C
  • Very low switching energy
  • Low inductive compact design for an higher power density
  • Si3N4 AMB substrate to improve thermal performance
  • SiC Power MOSFET chip sintered to substrate for improved lifetime
  • 4.2 kV DC 1 s insulation
  • Directly liquid cooled base plate with pin-fins
  • Three integrated NTC temperature sensors