B-L462E-CELL1

Cellular IoT Discovery kit powered by STM32L4 and ST4SIM

Parameters

Core Product	STM32L462RE
ECCN US	5A992.c
ECCN EU	NEC
Packing Type	Not Applicable
RoHs compliant	Ecopack1
Grade	Industrial
Package Name	CARD

Description

The B-L462E-CELL1 Discovery kit is a turnkey development platform for cellular IoT devices. The Discovery kit contains a low-power Discovery main board powered by an LBAD0ZZ1SE module, a global coverage antenna, and a fan-out board. The LBAD0ZZ1SE module includes an STM32L462REY6TR...
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Key features

Key features
LBAD0ZZ1SE module from Murata powered by STM32L462RE with built-in eSIM (ST4SIM-200M), LTE Cat M/NBIoT modem (LBAD0XX1SC-DM), and 1 Mbyte of Quad-SPI Flash memory Ultra-low-power STM32L4 Series STM32L462REY6TR microcontroller based on the Arm^® Cortex^®-M4 core with 512 Kbytes of Flash memory and 160 Kbytes of RAM in a WLCSP64 package 64 Mbytes of onboard Quad-SPI Flash memory from Micron^®, exclusive with the 1 MByte of Quad-SPI Flash memory inside the module 16 Kbytes of I²C EEPROM (M24128-DFMN6TP) from STMicroelectronics 0.96-inch 128 x 64 OLED screen with SPI interface Low-power Audio CODEC with PCM bus and I²C interface (MAX9867ETJ+ from Maxim) Ultra-low-power 3D accelerometer and 3D magnetometer (LSM303AGR) from STMicroelectronics Capacitive digital sensor for relative humidity and temperature (HTS221) from STMicroelectronics 260-1260 hPa absolute digital output barometer (LPS22HH) from STMicroelectronics 3 user LEDs 2 push-buttons (user and reset) Board connectors: SMA antenna connector Two 50-pin 2.54 mm pitch headers STMod+ micro-SIM card slot 3.5 mm CTIA stereo headset jack including analog microphone input USB Micro-B connectors for power, USARTs, USB device, and ST-LINK/V2-1 TAG10 mikroBUS expansion connectors ESP‑01 expansion connector Grove Seeed Studio™ breadboard, I²C, and UART expansion connectors Flexible power-supply options: ST-LINK USB, User USB, UART USB, Power USB, or three AAA batteries On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port, and debug port End-to-end connectivity applications Low‑power cellular network services from Truphone^® Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench^®, MDK-ARM, and STM32CubeIDE

In stock

Quantity	$ per unit	Savings
1	$74.72	0%
1 +	Contact sales

$74.72

Parameters

Core Product	STM32L462RE
ECCN US	5A992.c
ECCN EU	NEC
Packing Type	Not Applicable
RoHs compliant	Ecopack1
Grade	Industrial
Package Name	CARD

Description

Key features

Key features
LBAD0ZZ1SE module from Murata powered by STM32L462RE with built-in eSIM (ST4SIM-200M), LTE Cat M/NBIoT modem (LBAD0XX1SC-DM), and 1 Mbyte of Quad-SPI Flash memory Ultra-low-power STM32L4 Series STM32L462REY6TR microcontroller based on the Arm^® Cortex^®-M4 core with 512 Kbytes of Flash memory and 160 Kbytes of RAM in a WLCSP64 package 64 Mbytes of onboard Quad-SPI Flash memory from Micron^®, exclusive with the 1 MByte of Quad-SPI Flash memory inside the module 16 Kbytes of I²C EEPROM (M24128-DFMN6TP) from STMicroelectronics 0.96-inch 128 x 64 OLED screen with SPI interface Low-power Audio CODEC with PCM bus and I²C interface (MAX9867ETJ+ from Maxim) Ultra-low-power 3D accelerometer and 3D magnetometer (LSM303AGR) from STMicroelectronics Capacitive digital sensor for relative humidity and temperature (HTS221) from STMicroelectronics 260-1260 hPa absolute digital output barometer (LPS22HH) from STMicroelectronics 3 user LEDs 2 push-buttons (user and reset) Board connectors: SMA antenna connector Two 50-pin 2.54 mm pitch headers STMod+ micro-SIM card slot 3.5 mm CTIA stereo headset jack including analog microphone input USB Micro-B connectors for power, USARTs, USB device, and ST-LINK/V2-1 TAG10 mikroBUS expansion connectors ESP‑01 expansion connector Grove Seeed Studio™ breadboard, I²C, and UART expansion connectors Flexible power-supply options: ST-LINK USB, User USB, UART USB, Power USB, or three AAA batteries On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port, and debug port End-to-end connectivity applications Low‑power cellular network services from Truphone^® Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench^®, MDK-ARM, and STM32CubeIDE