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BAL-UWB-01E3
50Ω to 100Ω balun for UWB 3GHz to 8GHz
| Operating Temp Min Celsius | -40.0 |
| Operating Temp Max Celsius | 105.0 |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | FLIP CHIP BUMPLESS CSPG |
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.
This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
|
| Quantity | $ per unit | Savings |
|---|---|---|
| 1-9 | $0.34 | 1% |
| 10-99 | $0.29 | 14% |
| 100-499 | $0.27 | 21% |
| 500 | $0.26 | 23% |
| 500 + | Contact sales | |
| Operating Temp Min Celsius | -40.0 |
| Operating Temp Max Celsius | 105.0 |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | FLIP CHIP BUMPLESS CSPG |
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.
This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
|