Active
50Ω to 100Ω balun for UWB 3GHz to 8GHz
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 105.0 |
ECCN US | EAR99 |
ECCN EU | NEC |
Packing Type | Tape And Reel |
RoHs compliant | Ecopack2 |
Grade | Industrial |
Package Name | FLIP CHIP BUMPLESS CSPG |
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.
This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
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Quantity | $ per unit | Savings |
---|---|---|
1-9 | $0.40 | 1% |
10-99 | $0.27 | 32% |
100-249 | $0.24 | 40% |
250-499 | $0.22 | 44% |
500 | $0.22 | 44% |
500 + |
Contact sales |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 105.0 |
ECCN US | EAR99 |
ECCN EU | NEC |
Packing Type | Tape And Reel |
RoHs compliant | Ecopack2 |
Grade | Industrial |
Package Name | FLIP CHIP BUMPLESS CSPG |
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.
This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
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