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BAL-UWB-01E3

50Ω to 100Ω balun for UWB 3GHz to 8GHz

Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameFLIP CHIP BUMPLESS CSPG

The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.


This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.

Key features
  • Very low profile
  • High RF performance
  • PCB space saving
  • Efficient manufacturability
  • LGA footprint compatible
  • Low thickness ≤ 450 µm
In stock
Quantity $ per unit Savings
1-9$0.600%
10-99$0.5017%
100-249$0.4231%
250-499$0.3639%
500$0.3247%
Contact sales
$0.60
$0.60
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameFLIP CHIP BUMPLESS CSPG

The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.


This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.

Key features
  • Very low profile
  • High RF performance
  • PCB space saving
  • Efficient manufacturability
  • LGA footprint compatible
  • Low thickness ≤ 450 µm