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BALF-NRF01E3

50Ω nominal input / conjugate match balun to nRF51x22-QFAA, nRF51x22-QFAC, nRF51822-QFABBx and nRF51422-QFABAx with integrated filter

ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameFLIP CHIP BUMPLESS CSPG

STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.It uses STMicroelectronics IPD technology on...
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Key features
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated CSP on glass
  • Small footprint: < 1.5 mm2
  • Benefits
    • Very low profile
    • High RF performance
    • PCB space saving versus discrete solution
    • BOM count reduction
    • Efficient manufacturability
In stock
Quantity $ per unit Savings
1-9$0.490%
10-99$0.3137%
100-249$0.2744%
250-499$0.2549%
500$0.2451%
Contact sales
$0.49
$0.49
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameFLIP CHIP BUMPLESS CSPG

STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.It uses STMicroelectronics IPD technology on...
Read More

Key features
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated CSP on glass
  • Small footprint: < 1.5 mm2
  • Benefits
    • Very low profile
    • High RF performance
    • PCB space saving versus discrete solution
    • BOM count reduction
    • Efficient manufacturability