BALF-NRF01E3

50Ω nominal input / conjugate match balun to nRF51x22-QFAA, nRF51x22-QFAC, nRF51822-QFABBx and nRF51422-QFABAx with integrated filter

Parameters

ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	FLIP CHIP BUMPLESS CSPG

Description

STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.It uses STMicroelectronics IPD technology on...
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Key features

Key features
Low insertion loss Low amplitude imbalance Low phase imbalance Coated CSP on glass Small footprint: < 1.5 mm² Benefits Very low profile High RF performance PCB space saving versus discrete solution BOM count reduction Efficient manufacturability

In stock

Quantity	$ per unit	Savings
1-9	$0.33	1%
10-99	$0.23	31%
100-249	$0.22	34%
250-499	$0.20	39%
500	$0.20	39%
500 +	Contact sales

$0.33

Parameters

ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	FLIP CHIP BUMPLESS CSPG

Description

Key features

Key features
Low insertion loss Low amplitude imbalance Low phase imbalance Coated CSP on glass Small footprint: < 1.5 mm² Benefits Very low profile High RF performance PCB space saving versus discrete solution BOM count reduction Efficient manufacturability