EMIF02-SPK02F2

2-line EMI filter and ESD protection

Parameters

ECCN US	EAR99
ECCN EU	NEC
Package Size	1.26 x 0.89 x 0.65
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	CSP P 0.5 mm

Description

The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device.Additionally, this filter includes ESD...
Read More

Key features

Key features
Packaged in lead-free Flip Chip Very low resistance: 0.35 Ω High attenuation: -45 dB at 900 MHz Very low PCB space consumption:0.89 mm x 1.26 mm Very thin package: 0.65 mm High efficiency in ESD suppressionIEC6 1000-4-2 level 4 High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Complies with the following standards IEC 61000-4-2 level 4: ±15 kV (air discharge) ±8 kV (contact discharge)

In stock

Quantity	$ per unit	Savings
1-9	$0.28	29%
10-24	$0.24	39%
25-99	$0.22	44%
100-249	$0.22	46%
250-499	$0.20	49%
500	$0.20	51%
500 +	Contact sales

$0.28

Special Price $0.28 Regular Price $0.40

Parameters

ECCN US	EAR99
ECCN EU	NEC
Package Size	1.26 x 0.89 x 0.65
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	CSP P 0.5 mm

Description

Key features

Key features
Packaged in lead-free Flip Chip Very low resistance: 0.35 Ω High attenuation: -45 dB at 900 MHz Very low PCB space consumption:0.89 mm x 1.26 mm Very thin package: 0.65 mm High efficiency in ESD suppressionIEC6 1000-4-2 level 4 High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Complies with the following standards IEC 61000-4-2 level 4: ±15 kV (air discharge) ±8 kV (contact discharge)