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EMIF02-SPK03F2

2-line EMI filter and ESD protection for speaker phone

ECCN USEAR99
ECCN EUNEC
Package Size1.26 x 0.89 x 0.65
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The EMIF02-SPK03F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.The EMIF02-SPK03F2 is 2-channel, ultra compact, high attenuation filter available in 0.5 mm pitch WLCSP package. Additionally, this filter includes ESD protection circuitry, which...
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Key features
  • 2-channel EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering:
    • S21 attenuation, -40 dB at 900 MHz
    • Xtalk, in audio band, -60 dB
  • Very low PCB space consumption: 0.89 x 1.26 mm
  • Very thin package: 0.6 mm after reflow
  • High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Packaged in lead-free Flip Chip
  • Complies with the following standards
    • IEC 61000-4-2 level 4:
      • ±15 kV (air discharge)
      • ±8 kV (contact discharge)
In stock
Quantity $ per unit Savings
1-9$0.272%
10-24$0.254%
25-99$0.2310%
100-249$0.2215%
250-499$0.1928%
500$0.1544%
Contact sales
$0.27
$0.26
ECCN USEAR99
ECCN EUNEC
Package Size1.26 x 0.89 x 0.65
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The EMIF02-SPK03F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.The EMIF02-SPK03F2 is 2-channel, ultra compact, high attenuation filter available in 0.5 mm pitch WLCSP package. Additionally, this filter includes ESD protection circuitry, which...
Read More

Key features
  • 2-channel EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering:
    • S21 attenuation, -40 dB at 900 MHz
    • Xtalk, in audio band, -60 dB
  • Very low PCB space consumption: 0.89 x 1.26 mm
  • Very thin package: 0.6 mm after reflow
  • High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Packaged in lead-free Flip Chip
  • Complies with the following standards
    • IEC 61000-4-2 level 4:
      • ±15 kV (air discharge)
      • ±8 kV (contact discharge)