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NRND

EMIF02-USB03F2

2-line EMI filter and ESD protection with R pull-up for USB interfaces

ECCN USEAR99
ECCN EUNEC
Package Size1.94 x 1.44 x 0.65
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports.The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.Additionally, this filter includes ESD protection circuitry which prevents damage to the...
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Key features
  • 2-line, low-pass filter + 2-line ESD protection
  • High efficiency in EMI filtering
  • Lead-free package
  • Very low PCB space occupation: < 2.80 mm
  • Very thin package: 0.65 mm
  • High efficiency in ESD suppression (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
In stock
Quantity $ per unit Savings
1-9$0.450%
10-24$0.434%
25-49$0.3718%
50-99$0.3523%
100-249$0.3228%
250-300$0.3131%
Contact sales
$0.45
$0.45
ECCN USEAR99
ECCN EUNEC
Package Size1.94 x 1.44 x 0.65
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports.The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.Additionally, this filter includes ESD protection circuitry which prevents damage to the...
Read More

Key features
  • 2-line, low-pass filter + 2-line ESD protection
  • High efficiency in EMI filtering
  • Lead-free package
  • Very low PCB space occupation: < 2.80 mm
  • Very thin package: 0.65 mm
  • High efficiency in ESD suppression (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging