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EMIF06-HSD03F3

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6-line EMI filter with integrated ESD protection for micro-SD Card?

Quantity $ per Unit Savings
1 - 9$0.691%
10 - 99$0.5126%
100 - 499$0.4239%
500$0.4042%
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In stock
$0.69
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Parameter NameParameter Value
Operating Temp Min Celsius-30.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Package Size2.40 x 1.10 x 0.61
Packing TypeTape And Reel
ROHS Compliance GradeEcopack2
GradeIndustrial
Package NameCSP P 0.4 mm

The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.


The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.

Key features
  • Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)
  • High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)
  • Very low PCB space consumption:
    • 1.1 x 2.4 mm
  • Ultralow leakage current: 20 nA max.
  • Very thin package: 0.605 mm
  • Smart pinout for easier PCB layout
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead-free package
  • Complies with the following standards:
    • IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)