EMIF06-HSD03F3

6-line EMI filter with integrated ESD protection for micro-SD Card?

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Package Size	2.40 x 1.10 x 0.61
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	CSP P 0.4 mm

Description

The EMIF06-HSD03F3 is a 6-line highly integrated low pass filter designed to suppress EMI / RFI noise for micro secure digital interface.This filter integrates ESD protection diodes, designed to protect sensitive devices from damage when subjected to ESD surges up 18 kV contact.The very low line...
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Key features

Key features
EMI filter with integrated ESD protection on each SD card pins in one easy routing package Very low line capacitance to compensate long PCB tracks Ultra-low leakage current at V_RM: 20 nA max Very low PCB space consumption: 1.1 mm x 2.4 mm ECOPACK2 RoHS compliant component Benefits Very good matching between lines thanks to proprietary solid-state silicon technology Very low capacitance between lines to GND for optimized data integrity and speed Enhanced ESD protection with fast response time and low clamping voltage: IEC 61000-4-2 level 4 compliance guaranteed at device level, hence greater immunity at system level Integrated ESD protection of VCC and DET minimizes PCB space Easy PCB routing thanks to flow-through package pinout Complies with following standards: UL94, V0 IEC 61000-4-2 exceeding level 4: ±18 kV (air discharge – Ix pins) IEC 61000-4-2 exceeding level 4: ±18 kV (contact discharge – Ix pins)

In stock

Quantity	$ per unit	Savings
1-9	$0.53	0%
10-24	$0.44	17%
25-99	$0.39	27%
100-249	$0.36	32%
250-499	$0.33	38%
500	$0.31	41%
500 +	Contact sales

$0.53

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Package Size	2.40 x 1.10 x 0.61
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	CSP P 0.4 mm

Description

Key features

Key features
EMI filter with integrated ESD protection on each SD card pins in one easy routing package Very low line capacitance to compensate long PCB tracks Ultra-low leakage current at V_RM: 20 nA max Very low PCB space consumption: 1.1 mm x 2.4 mm ECOPACK2 RoHS compliant component Benefits Very good matching between lines thanks to proprietary solid-state silicon technology Very low capacitance between lines to GND for optimized data integrity and speed Enhanced ESD protection with fast response time and low clamping voltage: IEC 61000-4-2 level 4 compliance guaranteed at device level, hence greater immunity at system level Integrated ESD protection of VCC and DET minimizes PCB space Easy PCB routing thanks to flow-through package pinout Complies with following standards: UL94, V0 IEC 61000-4-2 exceeding level 4: ±18 kV (air discharge – Ix pins) IEC 61000-4-2 exceeding level 4: ±18 kV (contact discharge – Ix pins)