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EMIF08-VID1F3

8-line low capacitance EMI filter and ESD protection

Operating Temp Min Celsius85.0
Operating Temp Max Celsius-40.0
ECCN USEAR99
ECCN EUNEC
Package Size3.14 x 1.035 x 0.60
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.4 mm

This is a highly integrated 8-line device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.


This filter includes ESD protection circuitry, which prevents the application from damages when subjected to ESD surges up to 20 kV.

Key features
  • High efficiency in EMI filtering in wide filter bandwidth: better than -25 dB from 700 MHz to 3.0 GHz
  • Very thin package: 0.6 mm max.
  • High efficiency in ESD suppression on all input and output pins (exceeds IEC61000-4-2 level 4: ±20 kV contact discharge)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
Out of Stock
Quantity $ per unit Savings
1-9$0.570%
10-24$0.554%
25-49$0.537%
50-99$0.4324%
100-249$0.3932%
250-499$0.3638%
500$0.3441%
Contact sales
$0.57
Operating Temp Min Celsius85.0
Operating Temp Max Celsius-40.0
ECCN USEAR99
ECCN EUNEC
Package Size3.14 x 1.035 x 0.60
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.4 mm

This is a highly integrated 8-line device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.


This filter includes ESD protection circuitry, which prevents the application from damages when subjected to ESD surges up to 20 kV.

Key features
  • High efficiency in EMI filtering in wide filter bandwidth: better than -25 dB from 700 MHz to 3.0 GHz
  • Very thin package: 0.6 mm max.
  • High efficiency in ESD suppression on all input and output pins (exceeds IEC61000-4-2 level 4: ±20 kV contact discharge)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging