📢 Special June promo: $5.99 worldwide delivery until June 30th! No code or minimum order required. Shop now! 🛒

EV-VNH7070BAS

Active

VNH7070BAS Evaluation board

Quantity $ per Unit Savings
1 - 2$5.250%
Contact Sales
Out of stock
$5.25
Parameter NameParameter Value
Operating RangeAutomotive
Target ApplicationBody and Convenience
Core ProductVNH7070BAS
ECCN USEAR99
ECCN EUNEC
Packing TypeNot Applicable
RoHs compliantNot compliant
GradeIndustrial
Package NameCARD

EV-VNH7070BAS provides you an easy way to connect STMicroelectronics® VIPower® M0-7 H-Bridge drivers into your existing prototype circuitry. This evaluation board comes preassembled with VNH7070BAS H-Bridge. On board minimum set of electrical components (as for device datasheet recommendation) enables the user to directly connect the load, the power supply and the microcontroller without any additional effort in external component design and connection.


VNH7070BAS is a full bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver and two low-side switches. Both switches are designed using ST proprietary VIPower M0 technology that allows to efficiently integrate on the same die a true Power MOSFET with intelligent signal/protection circuitry. The three dies are assembled in a SO-16N package on electrically isolated leadframes.


Moreover, its fully symmetrical mechanical design allows superior manufacturability at board level.


The input signals INA and INB can directly interface the microcontroller to select the motor direction and the brake condition. A SEL0 pin is available to address the information available on the MultiSense to the microcontroller. The MultiSense pin allows to monitor the motor current by delivering a current proportional to the motor current value.


The PWM, up to 20 kHz, allows to control the speed of the motor in all possible conditions.

Key features
  • Simple single IC application board dedicated for VNH7070BAS
  • Provides electrical connectivity and thermal heat-sinking for easy prototyping