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    EVLSTDRIVE631N

    Demonstration board for STDRIVE631P and STDRIVE631N triple gate drivers

    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Packing TypeNot Applicable
    RoHs compliantEcopack1
    GradeIndustrial
    Package NameCARD
    Description

    The EVLSTDRIVE631P and EVLSTDRIVE631N demonstration boards are complete3-phase inverters that allow evaluating the STDRIVE631P or STDRIVE631N features. The power stage features STGD6M65DF2 IGBTs, but can be populated with any IGBT or power MOSFET in DPAK or PowerFLAT 8x8 HV package. The boards are...
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    Key features
    Key features
    • High-voltage rail up to 600 V
    • Driver supply input voltage range 9.5 V - 20 V
    • STGD6M65DF2 IGBTs power stage featuring:
      • V(BR)CES =
        650 V
      • VCE(sat) =
        1.55 V @ IC =
        6 A
    • Dual footprint for IGBT/MOSFET package:
      • DPAK
      • PowerFLAT 8x8 HV
    • Selectable single or 3-shunt current sensing topology:
      • Sensored or sensorless BEMF detection
      • FOC or 6-Step algorithm
    • SmartShutdown overcurrent protection
    • Hall effect sensors connector
    • Bus voltage sensing
    • 450 V bulk capacitor
    • Connector for interfacing with MCU
    • RoHS compliant
    Coming Soon
    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Packing TypeNot Applicable
    RoHs compliantEcopack1
    GradeIndustrial
    Package NameCARD
    Description

    The EVLSTDRIVE631P and EVLSTDRIVE631N demonstration boards are complete3-phase inverters that allow evaluating the STDRIVE631P or STDRIVE631N features. The power stage features STGD6M65DF2 IGBTs, but can be populated with any IGBT or power MOSFET in DPAK or PowerFLAT 8x8 HV package. The boards are...
    Read More

    Key features
    Key features
    • High-voltage rail up to 600 V
    • Driver supply input voltage range 9.5 V - 20 V
    • STGD6M65DF2 IGBTs power stage featuring:
      • V(BR)CES =
        650 V
      • VCE(sat) =
        1.55 V @ IC =
        6 A
    • Dual footprint for IGBT/MOSFET package:
      • DPAK
      • PowerFLAT 8x8 HV
    • Selectable single or 3-shunt current sensing topology:
      • Sensored or sensorless BEMF detection
      • FOC or 6-Step algorithm
    • SmartShutdown overcurrent protection
    • Hall effect sensors connector
    • Bus voltage sensing
    • 450 V bulk capacitor
    • Connector for interfacing with MCU
    • RoHS compliant