📢 $9.99 flat rate shipping in EMEA countries! Ends April 30th - Don't Miss Out!. 🛒 Shop now

Active

EVSPIN32F06Q1S3

3-phase inverter based on STSPIN32F0601Q with 3-shunt topology

ECCN US3A991.a.2
ECCN EUNEC
Packing TypeNot Applicable
RoHs compliantEcopack1
GradeIndustrial
Package NameCARD

The EVSPIN32F06Q1S3 board is a 3-phase complete inverter based on the STSPIN32F0601 controller, QFN 72L package version, which embeds a 3‑phase 600 V gate driver and a Cortex®‑M0 STM32 MCU. The power stage features STGD6M65DF2 IGBTs, but can be populated with any IGBT or Power MOSFET in DPAK...
Read More

Key features
  • Input voltage from 35 VAC (50 VDC) to 280 VAC (400 VDC)
  • Suitable for applications up to 300 W
  • STGD6M65DF2 IGBTs power stage featuring:
    • V(BR)CES = 650 V
    • VCE(sat) = 1.55 V @ IC = 6 A
  • Overcurrent threshold set to 4.5 Apeak
  • Dual footprint for IGBT/MOSFET package:
    • DPAK or PowerFlat 8x8 HV
  • 3-shunt current sensing, suitable for: sensored or sensorless vector control - FOC algorithm with 3-shunt sensing
  • Smart shutdown overcurrent protection
  • Digital Hall sensors and encoder input
  • Bus voltage sensing
  • 15 V VCC and 3.3 V VDD supplies
  • Embedded ST-LINK/V2-1
  • Easy user interface with buttons and trimmer
  • RoHS compliant
In stock
Quantity $ per unit Savings
1$108.100%
Contact sales
$108.10
$108.10
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeNot Applicable
RoHs compliantEcopack1
GradeIndustrial
Package NameCARD

The EVSPIN32F06Q1S3 board is a 3-phase complete inverter based on the STSPIN32F0601 controller, QFN 72L package version, which embeds a 3‑phase 600 V gate driver and a Cortex®‑M0 STM32 MCU. The power stage features STGD6M65DF2 IGBTs, but can be populated with any IGBT or Power MOSFET in DPAK...
Read More

Key features
  • Input voltage from 35 VAC (50 VDC) to 280 VAC (400 VDC)
  • Suitable for applications up to 300 W
  • STGD6M65DF2 IGBTs power stage featuring:
    • V(BR)CES = 650 V
    • VCE(sat) = 1.55 V @ IC = 6 A
  • Overcurrent threshold set to 4.5 Apeak
  • Dual footprint for IGBT/MOSFET package:
    • DPAK or PowerFlat 8x8 HV
  • 3-shunt current sensing, suitable for: sensored or sensorless vector control - FOC algorithm with 3-shunt sensing
  • Smart shutdown overcurrent protection
  • Digital Hall sensors and encoder input
  • Bus voltage sensing
  • 15 V VCC and 3.3 V VDD supplies
  • Embedded ST-LINK/V2-1
  • Easy user interface with buttons and trimmer
  • RoHS compliant