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    HDMI05-CL02F3

    5-line signal conditioning and ESD protection for HDMI interfaces

    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Package Size2.5 x 1.2
    Packing TypeTape And Reel
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameCSP P 0.4 mm
    Description

    The HDMI05-CL02F3 chip is a low capacitance ESD protection for HDMI control pins. It also integrates pull-up resistor for I²C bus and pulldown resistor for hot plug detect and pull-up resistor for CEC line.The ESD protection circuitry prevents damage to the protected device when subjected to ESD...
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    Key features
    Key features
    • Complies with the standards: IEC 61000-4-2 Level 4± 15 kV (air discharge)± 8 kV (contact discharge) IEC 61000-4-2 Level 1± 2 kV (air discharge)± 2 kV (contact discharge)
    • High reduction of parasitic elements through integration and wafer level packaging
    • Low line capacitance: 12 pF max.
    • Lead-free package
    • High efficiency in ESD protection
    • High reliability offered by monolithic integration
    • Very thin package
    In stock
    Quantity $ per unit Savings
    1-9$0.520%
    10-99$0.4514%
    100-499$0.3140%
    500$0.2453%
    500 + Contact sales
    $0.52
    $0.52
    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Package Size2.5 x 1.2
    Packing TypeTape And Reel
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameCSP P 0.4 mm
    Description

    The HDMI05-CL02F3 chip is a low capacitance ESD protection for HDMI control pins. It also integrates pull-up resistor for I²C bus and pulldown resistor for hot plug detect and pull-up resistor for CEC line.The ESD protection circuitry prevents damage to the protected device when subjected to ESD...
    Read More

    Key features
    Key features
    • Complies with the standards: IEC 61000-4-2 Level 4± 15 kV (air discharge)± 8 kV (contact discharge) IEC 61000-4-2 Level 1± 2 kV (air discharge)± 2 kV (contact discharge)
    • High reduction of parasitic elements through integration and wafer level packaging
    • Low line capacitance: 12 pF max.
    • Lead-free package
    • High efficiency in ESD protection
    • High reliability offered by monolithic integration
    • Very thin package