IIS3DWB10ISTR

Ultrawide bandwidth, low-noise, 3-axis digital vibration sensor with ISPU - intelligent sensor processing unit

Parameters

Operating Range	Industrial
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LLGA 4.5 X 4.5 X 1.5 MM MAX 16L

Description

The IIS3DWB10IS is a system-in-package featuring a 3-axis digital vibration sensor with low noise over an ultrawide and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity, along with the capability of operating over an extended temperature range (up to +125°C) and up to ±200 g acceleration full scale, make the device particularly suitable for vibration monitoring in any industrial application, including those in the harshest and most demanding environments.

The IIS3DWB10IS has a selectable full-scale acceleration range of ±50 / ±100 / ±200 g and is capable of measuring accelerations with a bandwidth above 10 kHz. A 2048-slot first-in, first-out (FIFO) buffer is integrated in the device to batch data from the integrated accelerometer, temperature sensor, or ISPU as well as to avoid any data loss and to limit intervention from the host processor.

The IIS3DWB10IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultralow-power, high-performance programmable core that can execute real-time signal processing and edge AI algorithms. The ISPU can be programmed in C code and can rely on an ecosystem with libraries and tools/IDE from ST and 3rd party.

Its optimized ultralow-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any wireless sensor node for Industry 5.0.

The MEMS sensor module family from ST leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve automotive, industrial, and consumer markets. The sensing elements are manufactured using ST’s proprietary micromachining process, while the embedded IC interfaces are developed using CMOS technology.

The IIS3DWB10IS has a self-test capability, which allows checking the functioning of the sensor in the final application. The IIS3DWB10IS is available in a 16-lead plastic, land grid array (LGA) package and is guaranteed to operate over an extended temperature range from -40°C to +125°C.

Key features

Key features
3-axis vibration sensor with digital output User-selectable full scale: ±50 / ±100 / ±200 g Ultrawide and flat frequency response range: from DC to above 10 kHz (±3 dB point) Equalization and filtering guarantee a flat and alias-free frequency response Ultralow noise density: down to 35 µg/√Hz Embedded ISPU (intelligent sensor processing unit): ultralow-power, high-performance programmable core to execute real-time signal processing and edge AI algorithms High stability of the sensitivity over temperature and against mechanical shocks Supports accurate external clock input in order to enable precise synchronization of an array of sensors and to improve ODR stability Extended temperature range from -40 to +125°C Multiple operating modes Continuous mode (CM) 40 / 80 kHz ODR @ >10 kHz bandwidth 2.5 / 5 / 10 / 20 kHz ODR @ ODR/2 bandwidth Burst mode (BM) Configurable burst of acquisitions in CM mode triggered by the ISPU, FIFO, internal timer, or external conditions Low power: 1.9 mA with one axis active, 4.1 mA with all three axes active SPI serial interface / MIPI I3C^® serial interface Embedded FIFO: 2048 slots with configurable batching for accelerometer, temperature sensor, and ISPU data Embedded temperature sensor Embedded self-test Supply voltage: 1.7 V to 3.6 V Compact package: LGA 4.5 x 4.5 x 1.5 mm 16-lead with wettable flanks ECOPACK and RoHS compliant

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Parameters

Operating Range	Industrial
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LLGA 4.5 X 4.5 X 1.5 MM MAX 16L

Description

Its optimized ultralow-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any wireless sensor node for Industry 5.0.

Key features

Key features
3-axis vibration sensor with digital output User-selectable full scale: ±50 / ±100 / ±200 g Ultrawide and flat frequency response range: from DC to above 10 kHz (±3 dB point) Equalization and filtering guarantee a flat and alias-free frequency response Ultralow noise density: down to 35 µg/√Hz Embedded ISPU (intelligent sensor processing unit): ultralow-power, high-performance programmable core to execute real-time signal processing and edge AI algorithms High stability of the sensitivity over temperature and against mechanical shocks Supports accurate external clock input in order to enable precise synchronization of an array of sensors and to improve ODR stability Extended temperature range from -40 to +125°C Multiple operating modes Continuous mode (CM) 40 / 80 kHz ODR @ >10 kHz bandwidth 2.5 / 5 / 10 / 20 kHz ODR @ ODR/2 bandwidth Burst mode (BM) Configurable burst of acquisitions in CM mode triggered by the ISPU, FIFO, internal timer, or external conditions Low power: 1.9 mA with one axis active, 4.1 mA with all three axes active SPI serial interface / MIPI I3C^® serial interface Embedded FIFO: 2048 slots with configurable batching for accelerometer, temperature sensor, and ISPU data Embedded temperature sensor Embedded self-test Supply voltage: 1.7 V to 3.6 V Compact package: LGA 4.5 x 4.5 x 1.5 mm 16-lead with wettable flanks ECOPACK and RoHS compliant