LSM6DSK320XTR

6-axis IMU (inertial measurement unit) with enhanced vibration immunity, dual accelerometer up to 320 g, and embedded AI

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LGA 14L 2.5x3x0.86 mm

Description

The LSM6DSK320X is a compact, low-power, high-performance IMU that integrates a 3-axis digital low-g accelerometer with selectable full scale up to ±16 g, a 3-axis digital high-g accelerometer up to ±320 g, and a 3‑axis digital gyroscope. Its advanced architecture processes acceleration and...
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Key features

Key features
Enhanced vibration immunity PFAS-, lead-, and BPA-free Quad-channel architecture for UI, EIS, OIS, and high-g data processing Smart, always-aware experience for system power optimization Dual accelerometer channels Low-g channel ±2/±4/±8/±16 g full scale High-g channel ±32/±64/±128/±256/±320 g full scale Gyroscope full scale: ±250/±500/±1000/±2000/±4000 dps SPI / I²C & MIPI I3C^® v1.1 serial interface with main processor data synchronization Auxiliary SPI & MIPI I3C^® v1.1 for OIS data output for gyroscope and accelerometer Programmable finite state machine for accelerometer (high-g & low-g), gyroscope, and external sensor data processing with high rate @ 960 Hz Machine learning core with exportable features and filters for AI applications Embedded adaptive self-configuration (ASC) Embedded sensor fusion low-power (SFLP) algorithm OIS configurable from the auxiliary or primary interface EIS dedicated channel on primary interface with dedicated filtering Advanced pedometer, step detector, and step counter Significant motion detection, tilt detection Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click, high-g wake-up and high-g shock Smart FIFO up to 4.5 KB Embedded temperature sensor Independent I/O supply I²C voltage range: 1.62 V to 3.6 V SPI / MIPI I3C^® extended voltage range: 1.08 V to 3.6 V Supply current 6-axis configuration @ 0.67 mA in combo high-performance mode 9-axis configuration @ 0.80 mA in combo high-performance mode Compact footprint: 2.5 mm x 3 mm x 0.83 mm ECOPACK and RoHS compliant

Out of Stock

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LGA 14L 2.5x3x0.86 mm

Description

Key features

Key features
Enhanced vibration immunity PFAS-, lead-, and BPA-free Quad-channel architecture for UI, EIS, OIS, and high-g data processing Smart, always-aware experience for system power optimization Dual accelerometer channels Low-g channel ±2/±4/±8/±16 g full scale High-g channel ±32/±64/±128/±256/±320 g full scale Gyroscope full scale: ±250/±500/±1000/±2000/±4000 dps SPI / I²C & MIPI I3C^® v1.1 serial interface with main processor data synchronization Auxiliary SPI & MIPI I3C^® v1.1 for OIS data output for gyroscope and accelerometer Programmable finite state machine for accelerometer (high-g & low-g), gyroscope, and external sensor data processing with high rate @ 960 Hz Machine learning core with exportable features and filters for AI applications Embedded adaptive self-configuration (ASC) Embedded sensor fusion low-power (SFLP) algorithm OIS configurable from the auxiliary or primary interface EIS dedicated channel on primary interface with dedicated filtering Advanced pedometer, step detector, and step counter Significant motion detection, tilt detection Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click, high-g wake-up and high-g shock Smart FIFO up to 4.5 KB Embedded temperature sensor Independent I/O supply I²C voltage range: 1.62 V to 3.6 V SPI / MIPI I3C^® extended voltage range: 1.08 V to 3.6 V Supply current 6-axis configuration @ 0.67 mA in combo high-performance mode 9-axis configuration @ 0.80 mA in combo high-performance mode Compact footprint: 2.5 mm x 3 mm x 0.83 mm ECOPACK and RoHS compliant