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The LSM6DSO32X is a system-in-package featuring a 3D digital accelerometer at 32 g and a 3D digital gyroscope, boosting power performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience in wearable, hard-fall detection, navigation and asset tracking applications.
The LSM6DSO32X supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSO32X embeds a dedicated core for Machine Learning processing (MLC) and a Finite State Machine (FSM) that provides system flexibility, allowing some algorithms run in the application processor to be moved to the MEMS sensor with the advantage of consistent reduction in power consumption.
The LSM6DSO32X has a full-scale acceleration range of ±4/±8/±16/±32 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DSO32X the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO32X is available in a plastic land grid array (LGA) package.
