|Operating Temp Min Celsius||-40.0|
|Operating Temp Max Celsius||85.0|
|Packing Type||Tape And Reel|
|ROHS Compliance Grade||Ecopack2|
|Package Name||VFLGA2.5X3X.86 14L P.5 L.475X.25|
The LSM6DST is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DST supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DST has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DST fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DST OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).
High robustness to mechanical shock makes the LSM6DST the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DST is available in a plastic land grid array (LGA) package.