LSM6DSV32XTR

6-axis IMU (inertial measurement unit) with 32 g accelerometer and embedded sensor fusion, AI, Qvar for high-end applications

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LGA 14L 2.5x3x0.86 mm

Description

The LSM6DSV32X is a high-performance, low-power 6-axis small IMU, featuring a 3-axis digital accelerometer at 32 g and a 3-axis digital gyroscope, that offers the best IMU sensor with a triple-channel architecture for processing acceleration and angular rate data on three separate channels (user...
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Key features

Key features
Triple-channel architecture for UI, EIS, and OIS data processing Always-on experience with low power consumption for both accelerometer and gyroscope Smart FIFO up to 4.5 KB Android compliant ±4/±8/±16/±32 g full scale ±125/±250/±500/±1000/±2000/±4000 dps full scale SPI / I²C & MIPI I3C^® v1.1 serial interface with main processor data synchronization Auxiliary SPI for OIS data output for gyroscope and accelerometer OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C^® v1.1) EIS dedicated channel on primary interface with dedicated filtering Advanced pedometer, step detector, and step counter Significant motion detection, tilt detection Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz Machine learning core with exportable features and filters for AI applications Embedded adaptive self-configuration (ASC) Embedded Qvar (electrostatic sensor) for user interface functions (tap, double tap, triple tap, long press, L/R – R/L swipe) Embedded analog hub for ADC and processing analog input data Embedded sensor fusion low-power algorithm Embedded temperature sensor Analog supply voltage: 1.71 V to 3.6 V Independent IO supply (extended range: 1.08 V to 3.6 V) Power consumption: 0.65 mA in combo high-performance mode Compact footprint: 2.5 mm x 3 mm x 0.83 mm ECOPACK and RoHS compliant

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Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LGA 14L 2.5x3x0.86 mm

Description

Key features

Key features
Triple-channel architecture for UI, EIS, and OIS data processing Always-on experience with low power consumption for both accelerometer and gyroscope Smart FIFO up to 4.5 KB Android compliant ±4/±8/±16/±32 g full scale ±125/±250/±500/±1000/±2000/±4000 dps full scale SPI / I²C & MIPI I3C^® v1.1 serial interface with main processor data synchronization Auxiliary SPI for OIS data output for gyroscope and accelerometer OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C^® v1.1) EIS dedicated channel on primary interface with dedicated filtering Advanced pedometer, step detector, and step counter Significant motion detection, tilt detection Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz Machine learning core with exportable features and filters for AI applications Embedded adaptive self-configuration (ASC) Embedded Qvar (electrostatic sensor) for user interface functions (tap, double tap, triple tap, long press, L/R – R/L swipe) Embedded analog hub for ADC and processing analog input data Embedded sensor fusion low-power algorithm Embedded temperature sensor Analog supply voltage: 1.71 V to 3.6 V Independent IO supply (extended range: 1.08 V to 3.6 V) Power consumption: 0.65 mA in combo high-performance mode Compact footprint: 2.5 mm x 3 mm x 0.83 mm ECOPACK and RoHS compliant