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M24256X-FCU6T/VF

Active

256-Kbit serial I2C bus EEPROM

Quantity $ per Unit Savings
1 - 9$0.570%
10 - 99$0.528%
100 - 250$0.4620%
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In stock
$0.57
Parameter NameParameter Value
Supply Voltage Min Volt1.6
Supply Voltage Max Volt5.5
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameWLCSP ULTRA-THIN

The M24256X-F is a 256-Kbit I2C-compatible EEPROM (electrically erasable programmable memory) organized as 32 K × 8 bits.


The M24256X-F can operate with a supply voltage from 1.65 V to 3.6 V, with a clock frequency up to 1 MHz, over an ambient temperature range from -40 °C to +85 °C. It can also operate down to 1.6 V, under some restricting conditions.


The M24256X-F offers three additional features, namely a 64-byte page, named identification page, which can be used to store sensitive application parameters that can be (later) permanently locked in read-only mode, a first 8-bit register, named configurable device address (CDA) register, authorizing the user, through software, to configure up to eight possibilities of chip enable address, and a second 8-bit register, named software write protection (SWP) register, authorizing the user, through software, to write protect a part or the full memory array.

Key features
  • Compatible with following I2C bus modes:
    • 1 MHz (Fast-mode Plus)
    • 400 kHz (Fast-mode)
    • 100 kHz (Standard-mode)
  • Memory array:
    • 256 Kbit (32 Kbytes) of EEPROM
    • Page size: 64 bytes
    • Additional identification page
  • Configurable device address register
  • Software write protection register
  • Single supply voltage: 1.6 to 3.6 V
  • Operating temperature range: -40 °C up to +85 °C
  • Write cycle time:
    • Byte write within 5 ms
    • Page write within 5 ms
  • Random and sequential read modes
  • Enhanced ESD / latch-up protection
  • More than 4 million write cycles
  • More than 200-year data retention
  • Package
    • WLCSP 4-ball (ECOPACK2)
    • Unsawn wafer (each die is tested)