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MLPF-WB-01E3
2.4 GHz Matched filter companion chip for STM32WB55Cx, STM32WB55Rx, STM32WB35xxx, STM32WB50xxx and STM32WB30xxx
| Operating Temp Min Celsius | -40.0 |
| Operating Temp Max Celsius | 105.0 |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | FLIP CHIP BUMPLESS CSPG |
The MLPF-WB-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
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In stock
| Quantity | $ per unit | Savings |
|---|---|---|
| 1-9 | $0.27 | 2% |
| 10-99 | $0.20 | 22% |
| 100-249 | $0.19 | 25% |
| 250-499 | $0.18 | 30% |
| 500 | $0.17 | 33% |
| 500 + | Contact sales | |
$0.27
$0.26
| Operating Temp Min Celsius | -40.0 |
| Operating Temp Max Celsius | 105.0 |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | FLIP CHIP BUMPLESS CSPG |
The MLPF-WB-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
|