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MPXC2011DT1

0 to 10 kPa, differential, compensated pressure sensor

ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack1
GradeIndustrial
Package NameSIL4_6.35x9.25_1.27p 4L

STMicroelectronics has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier...
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Key features
  • Integrated temperature compensation and calibration
  • Ratiometric to supply voltage
  • Polysulfone case material (ISO 10993)
  • Provided in easy-to-use tape and reel
Coming Soon
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack1
GradeIndustrial
Package NameSIL4_6.35x9.25_1.27p 4L

STMicroelectronics has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier...
Read More

Key features
  • Integrated temperature compensation and calibration
  • Ratiometric to supply voltage
  • Polysulfone case material (ISO 10993)
  • Provided in easy-to-use tape and reel