MTP-TC3P-DVK

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Evaluation Kit for Telemaco3P STA1385 Processor in Telematics Platform Application

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Parameter NameParameter Value
Core ProductSTA1385
CoreArm Cortex-M3
ECCN US5A992C
ECCN EU5A002A4
Packing TypeNot Applicable
ROHS Compliance GradeEcopack1
GradeIndustrial
Package NameCARD
Key features
  • Telemaco3P core processor module with 16x16 LFBGA (0.8 mm pitch) STA1385 Telemaco3P, 64 MB SQI NOR, 2 Gb NAND Flash, 2 8 GB EMMC, 512 MB DDR3L
  • Crash detection accelerometers
  • Teseo III multi-constellation GNSS system
  • 6-axis accelerometer, odometer and rear gear engaged circuit for dead reckoning
  • 2 Ethernet, compliant with IEEE-802.3-2002
  • 1 user and reset push-buttons
  • Backup battery circuit
  • MEMS microphone and class-D audio out
  • Board connectors:
    • 2 Ethernet RJ45
    • FlexRay and 100Base-T1 headers
    • 3 DB-9 CAN/CAN-FD
    • 2 mini-B USB
    • mini-B USB-UART debug port
    • SD™ card slot
    • RCA amplified audio out
    • SMA external GNSS antenna
    • JTAG connector
  • Board expansion connectors:
    • LTE modem module
    • Wi-Fi module
    • V2X module
    • Solder on ST33 e-SIM / HSM
    • Alternative MEMS sensors module
    • Precise positioning with dual-band Teseo-APP and L-Band Teseo –L modules