MTP-TC3P-DVK

Evaluation Kit for Telemaco3P STA1385 Processor in Telematics Platform Application
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Key features
Telemaco3P core processor module with 16x16 LFBGA (0.8 mm pitch) STA1385 Telemaco3P, 64 MB SQI NOR, 2 Gb NAND Flash, 2 8 GB EMMC, 512 MB DDR3L Crash detection accelerometers Teseo III multi-constellation GNSS system 6-axis accelerometer, odometer and rear gear engaged circuit for dead reckoning 2 Ethernet, compliant with IEEE-802.3-2002 1 user and reset push-buttons Backup battery circuit MEMS microphone and class-D audio out Board connectors: 2 Ethernet RJ45 FlexRay and 100Base-T1 headers 3 DB-9 CAN/CAN-FD 2 mini-B USB mini-B USB-UART debug port SD™ card slot RCA amplified audio out SMA external GNSS antenna JTAG connector Board expansion connectors: LTE modem module Wi-Fi module V2X module Solder on ST33 e-SIM / HSM Alternative MEMS sensors module Precise positioning with dual-band Teseo-APP and L-Band Teseo –L modules

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