OIMMA8MBHP01745$

SIM & eSIM system-on-chip solution for secure M2M industrial applications

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	VFDFPN 8 5X6 WETTABLE FLANK

Description

The ST4SIM-110M is an STMicroelectronics SIM and embedded SIM (eSIM or eUICC) product designed for all industrial devices.The ST4SIM-110M pre-integrates a cellular connectivity configuration provided by trusted partners. In this way, the product is ready to be deployed to the field.The device...
Read More

Key features

Key features
Cellular network connectivity configuration provided by trusted partners Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks Network access applications supported: SIM / USIM / ISIM / CSIM Secure element access control (ARF / PKCS#15) OTA capability over SMS, CAT-TP & HTTPS (including DNS) Multi-interfaces able to combine (U)SIM + eSE Hardware Product available on ST33G1M2M ST33 product based on a 32-bit Arm^® SecurCore^® SC300^™ RISC core Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V) Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol) Serial peripheral interface (SPI), depending on packages Industrial qualification (JEDEC JESD47) Operating temperature: -40°C to +105°C Common Criteria EAL5+ ECOPACK-compliant packages 2FF, 3FF or 4FF plugin card (based on D16 micromodule) DFN8 with wettable flanks (MFF2) WLCSP11 Security Symmetric cryptography DES / 3DES / AES Asymmetric cryptography RSA (up to 2048 bits) HTTPS remote management TLS v1.0, v1.1 and v1.2 Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1 Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE Software standard compliancy Java^® Card v3.0.4 Classic GlobalPlatform^® card specification v2.2, including GP amendments A, B, C, D and E ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office) Power saving features (PSM and eDRX) defined by ETSI release 13

Out of Stock

Quantity	$ per unit	Savings
1-500	$0.00	0%
500 +	Contact sales

$0.00

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	VFDFPN 8 5X6 WETTABLE FLANK

Description

Key features

Key features
Cellular network connectivity configuration provided by trusted partners Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks Network access applications supported: SIM / USIM / ISIM / CSIM Secure element access control (ARF / PKCS#15) OTA capability over SMS, CAT-TP & HTTPS (including DNS) Multi-interfaces able to combine (U)SIM + eSE Hardware Product available on ST33G1M2M ST33 product based on a 32-bit Arm^® SecurCore^® SC300^™ RISC core Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V) Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol) Serial peripheral interface (SPI), depending on packages Industrial qualification (JEDEC JESD47) Operating temperature: -40°C to +105°C Common Criteria EAL5+ ECOPACK-compliant packages 2FF, 3FF or 4FF plugin card (based on D16 micromodule) DFN8 with wettable flanks (MFF2) WLCSP11 Security Symmetric cryptography DES / 3DES / AES Asymmetric cryptography RSA (up to 2048 bits) HTTPS remote management TLS v1.0, v1.1 and v1.2 Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1 Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE Software standard compliancy Java^® Card v3.0.4 Classic GlobalPlatform^® card specification v2.2, including GP amendments A, B, C, D and E ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office) Power saving features (PSM and eDRX) defined by ETSI release 13