SH63N65DM6AG

Automotive-grade N-channel 650 V, 56 mOhm typ., 53 A MDmesh DM6 Power MOSFET in an ACEPACK SMIT package

Parameters

ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive
Package Name	ACEPACK SMIT

Description

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The...
Read More

Key features

Key features
AQG 324 qualified Half-bridge power module 650 V blocking voltage Fast recovery body diode Very low switching energies Low package inductance Dice on direct bond copper (DBC) substrate Low thermal resistance Isolation rating of 3.4 kVrms/min

Out of Stock

Quantity	$ per unit	Savings
1-9	$26.55	0%
10	$20.25	24%
10 +	Contact sales

$26.55

Parameters

ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive
Package Name	ACEPACK SMIT

Description

Key features

Key features
AQG 324 qualified Half-bridge power module 650 V blocking voltage Fast recovery body diode Very low switching energies Low package inductance Dice on direct bond copper (DBC) substrate Low thermal resistance Isolation rating of 3.4 kVrms/min