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SH63N65DM6AG

Automotive-grade N-channel 650 V, 56 mOhm typ., 53 A MDmesh DM6 Power MOSFET in an ACEPACK SMIT package

ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeAutomotive
Package NameACEPACK SMIT

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The...
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Key features
  • AQG 324 qualified
  • Half-bridge power module
  • 650 V blocking voltage
  • Fast recovery body diode
  • Very low switching energies
  • Low package inductance
  • Dice on direct bond copper (DBC) substrate
  • Low thermal resistance
  • Isolation rating of 3.4 kVrms/min
In stock
Quantity $ per unit Savings
1-9$27.070%
10-24$24.968%
25-99$23.8412%
100-199$21.3221%
200-399$20.3325%
400-500$19.3529%
Contact sales
$27.07
$27.07
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeAutomotive
Package NameACEPACK SMIT

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The...
Read More

Key features
  • AQG 324 qualified
  • Half-bridge power module
  • 650 V blocking voltage
  • Fast recovery body diode
  • Very low switching energies
  • Low package inductance
  • Dice on direct bond copper (DBC) substrate
  • Low thermal resistance
  • Isolation rating of 3.4 kVrms/min