SH68N65DM6AG

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Automotive-grade N-channel 650 V, 35 mOhm typ., 64 A MDmesh DM6 half-bridge topology Power MOSFET in an ACEPACK SMIT package

Quantity $ per Unit Savings
1 - 9$35.080%
10 - 24$32.368%
25 - 99$30.9112%
100 - 199$27.6421%
200 - 399$27.6321%
400 - 500$27.4422%
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In stock
$35.08
Parameter NameParameter Value
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeAutomotive
Package NameACEPACK SMIT


This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.


Key features
  • AQG 324 qualified
  • Half-bridge power module
  • 650 V blocking voltage
  • Fast recovery body diode
  • Very low switching energies
  • Low package inductance
  • Dice on direct bond copper (DBC) substrate
  • Low thermal resistance
  • Isolation rating of 3.4 kVrms/min