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SH70M12W3AG
Automotive-grade ACEPACK SMIT half-bridge topology featuring 1200 V, 67 mOhm typ., 28 A SiC Power MOSFET
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Automotive |
| Package Name | ACEPACK SMIT |
The ACEPACK SMIT is a very compact surface mounted SiC MOSFET module. Thanks to the DBC substrate, the ACEPACK SMIT package provides reliable insulation, a low thermal resistance and high flexibility, enabling several configurations.The SiC MOSFETs inside provide outstanding features, like very low...
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| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Automotive |
| Package Name | ACEPACK SMIT |
The ACEPACK SMIT is a very compact surface mounted SiC MOSFET module. Thanks to the DBC substrate, the ACEPACK SMIT package provides reliable insulation, a low thermal resistance and high flexibility, enabling several configurations.The SiC MOSFETs inside provide outstanding features, like very low...
Read More
|