SH70M12W3AG

Automotive-grade ACEPACK SMIT half-bridge topology featuring 1200 V, 67 mOhm typ., 28 A SiC Power MOSFET

Parameters

ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive
Package Name	ACEPACK SMIT

Description

The ACEPACK SMIT is a very compact surface mounted SiC MOSFET module. Thanks to the DBC substrate, the ACEPACK SMIT package provides reliable insulation, a low thermal resistance and high flexibility, enabling several configurations.The SiC MOSFETs inside provide outstanding features, like very low...
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Key features

Key features
AQG 324 qualified Half-bridge topology SiC MOSFET module 1200 V rated voltage Dice on direct bond copper (DBC) substrate SMD with insulated top side cooling Isolation voltage of 3.4 kVrms Low thermal resistance Package molding compound group I (CTI ≥ 600 V, 1000 Vrms in pollution degree 2)

Out of Stock

Quantity	$ per unit	Savings
1-500	$0.00	0%
500 +	Contact sales

$0.00

Parameters

ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive
Package Name	ACEPACK SMIT

Description

Key features

Key features
AQG 324 qualified Half-bridge topology SiC MOSFET module 1200 V rated voltage Dice on direct bond copper (DBC) substrate SMD with insulated top side cooling Isolation voltage of 3.4 kVrms Low thermal resistance Package molding compound group I (CTI ≥ 600 V, 1000 Vrms in pollution degree 2)