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SM5908

1500 W, 5 V TVS in SMC

ECCN USEAR99
ECCN EUNEC
Package Size8 x 5.9 x 2.3
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameSMC

This Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, and MIL STD 883, method 3015, and electrical over stress according to IEC 61000-4-4 and 5. These devices are more generally used against surges below 1500 W (10/1000...
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Key features
  • Peak pulse power:
    • 1500 W (10/1000 μs)
  • Stand off voltage: 5 V
  • Unidirectional
  • Operating Tj max: 175 °C
  • High power capability at Tj max:
    • 1500 W (10/1000 μs)
  • JEDEC registered package outline
  • Complies with the following standards
    • IEC 61000-4-2 level 4:
      • 15 kV (air discharge)
      • 8 kV (contact discharge)
    • IEC 61000-4-5
    • MIL STD 883G, method 3015-7 Class 3B
      • 25 kV HBM (human body model)
    • Resin meets UL 94, V0
    • MIL-STD-750, method 2026 solderability
    • EIA STD RS-481 and IEC 60286-3 packing
    • IPC 7531 footprint
In stock
Quantity $ per unit Savings
1-9$1.570%
10-60$1.2918%
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$1.57
$1.57
or
ECCN USEAR99
ECCN EUNEC
Package Size8 x 5.9 x 2.3
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameSMC

This Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, and MIL STD 883, method 3015, and electrical over stress according to IEC 61000-4-4 and 5. These devices are more generally used against surges below 1500 W (10/1000...
Read More

Key features
  • Peak pulse power:
    • 1500 W (10/1000 μs)
  • Stand off voltage: 5 V
  • Unidirectional
  • Operating Tj max: 175 °C
  • High power capability at Tj max:
    • 1500 W (10/1000 μs)
  • JEDEC registered package outline
  • Complies with the following standards
    • IEC 61000-4-2 level 4:
      • 15 kV (air discharge)
      • 8 kV (contact discharge)
    • IEC 61000-4-5
    • MIL STD 883G, method 3015-7 Class 3B
      • 25 kV HBM (human body model)
    • Resin meets UL 94, V0
    • MIL-STD-750, method 2026 solderability
    • EIA STD RS-481 and IEC 60286-3 packing
    • IPC 7531 footprint