SPC570S50E1CEFAY

32-bit Power Architecture MCU for Automotive Chassis and Safety Applications

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	e200z0
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	TQFP-EP 64 10x10x1.0 mm

Description

The SPC570Sx is a family of next generation microcontrollers built on the Power Architecture embedded category.The SPC570Sx family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products...
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Key features

Key features
AEC-Q100 qualified High performance e200z0h dual core 32-bit Power Architecture technology CPU Core frequency as high as 80 MHz Single issue 4-stage pipeline in-order execution core Variable Length Encoding (VLE) Up to 544 KB (512 KB code + 32 KB data, suitable for EEPROM emulation) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation Up to 48 KB on-chip general-purpose SRAM Multi-channel direct memory access controller (eDMA paired in lockstep) with 16 channels Comprehensive new generation ASILD safety concept Safety of bus masters (core+INTC, DMA) by delayed lockstep approach Safety of storage (Flash, SRAM) by mainly ECC Safety of the data path to storage and periphery by mainly End-to-End EDC (E2E EDC) Clock and power, generation and distribution, supervised by dedicated monitors Fault Collection and Control Unit (FCCU) for collection and reaction to failure notifications Memory Error Management Unit (MEMU) for collection and reporting of error events in memories Boot time MBIST and LBIST for latent faults Check of safety mechanisms availability and error reaction path functionality by dedicated mechanisms Safety of the periphery by application-level measures supported by replicated peripheral bridges and by LBIST Further measures on dedicated peripherals (e.g. ADC supervisor) Junction temperature sensor 8-region system memory protection unit (SMPU) with process ID support (tasks isolation) Enhanced SW watchdog Cyclic redundancy check (CRC) unit Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus Class 3 debug and trace interface Communication interfaces 2 LINFlexD modules, 3 deserial serial peripheral interface (DSPI) modules, and Up to 2 FlexCAN interfaces with 32 message buffers each On-chip CAN/UART Bootstrap loader with Boot Assisted Flash (BAF). Physical Interface (PHY) can be UART and CAN 2 enhanced 12-bit SAR analog converters 1.5 μs conversion time (12 MHz) 16 physical channels (fully shared between the 2 SARADC units) Supervisor ADC concept Programmable Cross Triggering Unit (CTU) Single 3.3 V or 5 V voltage supply 4 general purpose eTimer units (6 channels each) Junction temperature range -40 °C to 150 °C (165 °C grade optional)

In stock

Quantity	$ per unit	Savings
1-9	$10.00	0%
10-24	$7.72	23%
25-99	$7.37	26%
100-249	$6.40	36%
250-499	$6.11	39%
500	$5.59	44%
500 +	Contact sales

$10.00

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	e200z0
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	TQFP-EP 64 10x10x1.0 mm

Description

Key features

Key features
AEC-Q100 qualified High performance e200z0h dual core 32-bit Power Architecture technology CPU Core frequency as high as 80 MHz Single issue 4-stage pipeline in-order execution core Variable Length Encoding (VLE) Up to 544 KB (512 KB code + 32 KB data, suitable for EEPROM emulation) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation Up to 48 KB on-chip general-purpose SRAM Multi-channel direct memory access controller (eDMA paired in lockstep) with 16 channels Comprehensive new generation ASILD safety concept Safety of bus masters (core+INTC, DMA) by delayed lockstep approach Safety of storage (Flash, SRAM) by mainly ECC Safety of the data path to storage and periphery by mainly End-to-End EDC (E2E EDC) Clock and power, generation and distribution, supervised by dedicated monitors Fault Collection and Control Unit (FCCU) for collection and reaction to failure notifications Memory Error Management Unit (MEMU) for collection and reporting of error events in memories Boot time MBIST and LBIST for latent faults Check of safety mechanisms availability and error reaction path functionality by dedicated mechanisms Safety of the periphery by application-level measures supported by replicated peripheral bridges and by LBIST Further measures on dedicated peripherals (e.g. ADC supervisor) Junction temperature sensor 8-region system memory protection unit (SMPU) with process ID support (tasks isolation) Enhanced SW watchdog Cyclic redundancy check (CRC) unit Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus Class 3 debug and trace interface Communication interfaces 2 LINFlexD modules, 3 deserial serial peripheral interface (DSPI) modules, and Up to 2 FlexCAN interfaces with 32 message buffers each On-chip CAN/UART Bootstrap loader with Boot Assisted Flash (BAF). Physical Interface (PHY) can be UART and CAN 2 enhanced 12-bit SAR analog converters 1.5 μs conversion time (12 MHz) 16 physical channels (fully shared between the 2 SARADC units) Supervisor ADC concept Programmable Cross Triggering Unit (CTU) Single 3.3 V or 5 V voltage supply 4 general purpose eTimer units (6 channels each) Junction temperature range -40 °C to 150 °C (165 °C grade optional)