SPC570S50E3CEFAY

SPC570S50E3CEFAY

SPC570S50E3CEFAR Active

32-bit Power Architecture MCU for Automotive Chassis and Safety Applications
Quantity $ per Unit Savings
1 - 9$10.000%
10 - 24$9.0410%
25 - 99$8.6114%
100 - 249$7.5525%
250 - 499$7.3227%
500$6.2238%
Contact Sales
Out of stock
$10.00
Parameter NameParameter Value
Supply Voltage Min Volt3.0
Supply Voltage Max Volt5.5
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius125.0
Coree200z0
ECCN US5A991B4A
ECCN EUNEC
Packing TypeTape And Reel
ROHS Compliance GradeEcopack2
GradeAutomotive
Package NameTQFP 100 14x14x1.0
Key features
  • AEC-Q100 qualified
  • High performance e200z0h dual core
    • 32-bit Power Architecture technology CPU
    • Core frequency as high as 80 MHz
    • Single issue 4-stage pipeline in-order execution core
    • Variable Length Encoding (VLE)
  • Up to 544 KB (512 KB code + 32 KB data, suitable for EEPROM emulation) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
  • Up to 48 KB on-chip general-purpose SRAM
  • Multi-channel direct memory access controller (eDMA paired in lockstep) with 16 channels
  • Comprehensive new generation ASILD safety concept
    • Safety of bus masters (core+INTC, DMA) by delayed lockstep approach
    • Safety of storage (Flash, SRAM) by mainly ECC
    • Safety of the data path to storage and periphery by mainly End-to-End EDC (E2E EDC)
    • Clock and power, generation and distribution, supervised by dedicated monitors
    • Fault Collection and Control Unit (FCCU) for collection and reaction to failure notifications
    • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
    • Boot time MBIST and LBIST for latent faults
    • Check of safety mechanisms availability and error reaction path functionality by dedicated mechanisms
    • Safety of the periphery by application-level measures supported by replicated peripheral bridges and by LBIST
    • Further measures on dedicated peripherals (e.g. ADC supervisor)
    • Junction temperature sensor
    • 8-region system memory protection unit (SMPU) with process ID support (tasks isolation)
    • Enhanced SW watchdog
    • Cyclic redundancy check (CRC) unit
  • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
  • Nexus Class 3 debug and trace interface
  • Communication interfaces
    • 2 LINFlexD modules, 3 deserial serial per