SPC574S60E3CE0AY

32-bit Power Architecture MCU for Automotive Chassis and Safety Applications

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Dual e200z4d
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	TQFP 100 14x14x1.0

Description

The SPC574Sx is a family of next generation microcontrollers built on the Power Architecture embedded category.The SPC574Sx family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products...
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Key features

Key features
AEC-Q100 qualified High performance e200z4d dual core 32-bit Power Architecture technology CPU Core frequency as high as 140 MHz Dual issue 5-stage pipeline in-order execution core Variable Length Encoding (VLE) Core MPU Floating Point, End-to-End Error Correction 8 KB instruction cache with error detection code 32 KB local data RAM and 4 KB data cache along with 8 KB instruction cache 1600 KB (1.5 MB code + 64 KB data) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation 128 KB on-chip RAM (96 KB on chip RAM + 32 KB local data RAM) Multi-channel direct memory access controller (eDMA) with 32 channels Comprehensive new generation ASILD safety concept ASILD SEooC approach (Safety Element out of Context) FCCU for collection and reaction to failure notifications Memory Error Management Unit (MEMU) for collection and reporting of error events in memories End-to-end Error Correction Code (e2eECC) logic Cyclic redundancy check (CRC) unit 8 enhanced 12-bit SAR analog converters 2 sets of: 3 ADCs and one supervisor ADC 1.5 µs conversion time at 12 MHz Up to 32 physical channels Dual Programmable CTU 4 general purpose eTimer units (6 channels each) 4 FlexPWM units 2 (4 channels each) used for motor control with hardware synchronization between the control systems 2 (2 channels each) used for SWG emulation Communication interfaces 4 LINFlexD modules 4 deserial serial peripheral interface (DSPI) modules 2 MCAN interfaces with advanced shared memory scheme (808 x 32-bit words for MCAN0 and 520 x 32-bit words for MCAN1) and CAN-FD support 1 FlexRay module with 2 channels, 128 message buffers 2 SENT interfaces (3 channels each) Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus Class 3 debug and trace interface On-chip CAN/UART Bootstrap loader with BAF. Physical Interface (PHY) can be UART Advanced and flexible supply scheme On-chip voltage regulator for 1.2 V core logic supply. Bypass mode supported for external 1.2 V core logic supply 3.3 V or 5 V IO and ADC supply (2 independent power domains available) Junction temperature range -40 °C to 150 °C

Out of Stock

Quantity	$ per unit	Savings
1-9	$16.71	0%
10-24	$15.36	8%
25-99	$14.73	12%
100-249	$12.98	22%
250-500	$12.34	26%
500 +	Contact sales

$16.71

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Dual e200z4d
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	TQFP 100 14x14x1.0

Description

Key features

Key features
AEC-Q100 qualified High performance e200z4d dual core 32-bit Power Architecture technology CPU Core frequency as high as 140 MHz Dual issue 5-stage pipeline in-order execution core Variable Length Encoding (VLE) Core MPU Floating Point, End-to-End Error Correction 8 KB instruction cache with error detection code 32 KB local data RAM and 4 KB data cache along with 8 KB instruction cache 1600 KB (1.5 MB code + 64 KB data) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation 128 KB on-chip RAM (96 KB on chip RAM + 32 KB local data RAM) Multi-channel direct memory access controller (eDMA) with 32 channels Comprehensive new generation ASILD safety concept ASILD SEooC approach (Safety Element out of Context) FCCU for collection and reaction to failure notifications Memory Error Management Unit (MEMU) for collection and reporting of error events in memories End-to-end Error Correction Code (e2eECC) logic Cyclic redundancy check (CRC) unit 8 enhanced 12-bit SAR analog converters 2 sets of: 3 ADCs and one supervisor ADC 1.5 µs conversion time at 12 MHz Up to 32 physical channels Dual Programmable CTU 4 general purpose eTimer units (6 channels each) 4 FlexPWM units 2 (4 channels each) used for motor control with hardware synchronization between the control systems 2 (2 channels each) used for SWG emulation Communication interfaces 4 LINFlexD modules 4 deserial serial peripheral interface (DSPI) modules 2 MCAN interfaces with advanced shared memory scheme (808 x 32-bit words for MCAN0 and 520 x 32-bit words for MCAN1) and CAN-FD support 1 FlexRay module with 2 channels, 128 message buffers 2 SENT interfaces (3 channels each) Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus Class 3 debug and trace interface On-chip CAN/UART Bootstrap loader with BAF. Physical Interface (PHY) can be UART Advanced and flexible supply scheme On-chip voltage regulator for 1.2 V core logic supply. Bypass mode supported for external 1.2 V core logic supply 3.3 V or 5 V IO and ADC supply (2 independent power domains available) Junction temperature range -40 °C to 150 °C