📢 Final call: FREE worldwide delivery ends on Mar. 31! No min purchase or code needed. 🛒 Shop now

SPC582B54E1CG00X

SPC582B54E1CG00X

Active

SPC582B54E1BD00X

32-bit Power Architecture MCU for Automotive General Purpose Applications - Chorus family

Supply Voltage Min Volt3.0
Supply Voltage Max Volt5.5
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
Coree200z2
ECCN US5A991.b.4.a
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeAutomotive Safety
Package NameTQFP 64 10x10x1.0

The SPC582Bx microcontroller is the entry member of a new family of devices superseding the SPC560Bx family.SPC582Bx is built on the legacy of the SPC5x products, while introducing new features to answer the future requirements like the ASIL-B classification, high number of ISO CAN-FD channels, and...
Read More

Key features
  • AEC-Q100 qualified
  • High performance e200z2 single core
    • 32-bit power architecture technology CPU
    • Core frequency as high as 80 MHz
    • Variable length encoding (VLE)
    • Floating point, End-to-End error correction
  • 1088 KB (1024 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
  • 96 KB on-chip general-purpose SRAM
  • Multi-channel direct memory access controller (eDMA) with 16 channels
  • 1 interrupt controller (INTC)
  • Comprehensive new generation ASIL-B safety concept
    • ASIL-B of ISO 26262
    • FCCU for collection and reaction to failure notifications
    • Memory error management Unit (MEMU) for collection and reporting of error events in memories
    • Cyclic redundancy check (CRC) unit
    • End-to-end error correction code (e2eECC) logic
  • Crossbar switch architecture for concurrent access to peripherals, flash, or RAM from multiple bus masters with end-to-end ECC
  • Body cross triggering unit (BCTU)
    • Triggers ADC conversions from any eMIOS channel
    • Triggers ADC conversions from up to 2 dedicated PIT_RTIs
    • 1 event configuration register dedicated to each timer event allows to define the corresponding ADC channel
    • Synchronization with ADC to avoid collision
  • 1 enhanced 12-bit SAR analog-to-digital converters
    • Up to 27 channels
    • enhanced diagnosis feature
  • Communication interfaces
    • 6 LINFlexD modules
    • 4 deserial serial peripheral interface (DSPI) modules
    • 7 MCAN interfaces with advanced shared memory scheme and ISO CAN FD support
  • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
  • Nexus Class 3 debug and trace interface
  • Boot assist flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART.
  • Enhanced modular IO subsystem (eMIOS): up to 32 timed I/O channels with 16-bit counter resolution
  • Advanced and flexible supply scheme
    • On-chip voltage regulator for 1.2 V core logic supply.
  • Junction temperature range -40 °C to 150 °C
Out of Stock
Quantity $ per unit Savings
1-9$10.000%
10-24$9.0410%
25-99$8.6214%
100-249$7.4925%
250-499$7.1429%
500$6.5235%
Contact sales
$10.00
Supply Voltage Min Volt3.0
Supply Voltage Max Volt5.5
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
Coree200z2
ECCN US5A991.b.4.a
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeAutomotive Safety
Package NameTQFP 64 10x10x1.0

The SPC582Bx microcontroller is the entry member of a new family of devices superseding the SPC560Bx family.SPC582Bx is built on the legacy of the SPC5x products, while introducing new features to answer the future requirements like the ASIL-B classification, high number of ISO CAN-FD channels, and...
Read More

Key features
  • AEC-Q100 qualified
  • High performance e200z2 single core
    • 32-bit power architecture technology CPU
    • Core frequency as high as 80 MHz
    • Variable length encoding (VLE)
    • Floating point, End-to-End error correction
  • 1088 KB (1024 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
  • 96 KB on-chip general-purpose SRAM
  • Multi-channel direct memory access controller (eDMA) with 16 channels
  • 1 interrupt controller (INTC)
  • Comprehensive new generation ASIL-B safety concept
    • ASIL-B of ISO 26262
    • FCCU for collection and reaction to failure notifications
    • Memory error management Unit (MEMU) for collection and reporting of error events in memories
    • Cyclic redundancy check (CRC) unit
    • End-to-end error correction code (e2eECC) logic
  • Crossbar switch architecture for concurrent access to peripherals, flash, or RAM from multiple bus masters with end-to-end ECC
  • Body cross triggering unit (BCTU)
    • Triggers ADC conversions from any eMIOS channel
    • Triggers ADC conversions from up to 2 dedicated PIT_RTIs
    • 1 event configuration register dedicated to each timer event allows to define the corresponding ADC channel
    • Synchronization with ADC to avoid collision
  • 1 enhanced 12-bit SAR analog-to-digital converters
    • Up to 27 channels
    • enhanced diagnosis feature
  • Communication interfaces
    • 6 LINFlexD modules
    • 4 deserial serial peripheral interface (DSPI) modules
    • 7 MCAN interfaces with advanced shared memory scheme and ISO CAN FD support
  • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
  • Nexus Class 3 debug and trace interface
  • Boot assist flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART.
  • Enhanced modular IO subsystem (eMIOS): up to 32 timed I/O channels with 16-bit counter resolution
  • Advanced and flexible supply scheme
    • On-chip voltage regulator for 1.2 V core logic supply.
  • Junction temperature range -40 °C to 150 °C