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SPC58EE84E7QMSAR

32-bit Power Architecture MCU for High Performance Applications

Operating Temp Min Celsius-40.0
Operating Temp Max Celsius125.0
CoreDual e200z4d
ECCN US5A991.b.4.a
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeAutomotive Safety
Package NameLQFP 176 24x24x1.4

The data sheet provides electrical specifications, pin assignments, and package diagrams for the SPC5x series of microcontroller units (MCUs). For functional characteristics, see the SPC5x microcontroller reference manual.The SPC58xEx microcontroller is the first in a new family of devices...
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Key features
  • AEC-Q100 qualified
  • 32-bit Power Architecture VLE compliant CPU cores:
    • Three main CPUs, dual issue, 32-bit CPU core complexes (e200z4), two of them having one checker core in lock-step
    • Floating Point, End-to-End Error Correction
  • 6576 KB (6288 KB code flash + 288 KB data flash) on-chip flash memory:
    • supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
    • Supports read while read between the two code Flash partitions.
  • 608 KB on-chip general-purpose SRAM (in addition to 160 KB core local data RAM)
  • 96-channel direct memory access controller (eDMA)
  • Comprehensive new generation ASIL-D safety concept:
    • ASIL-D of ISO 26262
    • FCCU for collection and reaction to failure notifications
    • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
    • Cyclic redundancy check (CRC) unit
  • Dual-channel FlexRay controller
  • Hardware Security Module (HSM)
  • Junction temperature range -40 °C to 165 °C
  • GTM 343 - Generic Timer Module:
    • Intelligent complex timer module
    • 144 channels (40 input and 104 output)
    • 5 programmable fine grain multi-threaded cores
    • 24-bit wide channels
  • Enhanced analog-to-digital converter system with:
    • 1 supervisor 12-bit SAR analog converter
    • 4 separate fast 12-bit SAR analog converters
    • 3 separate 10-bit SAR analog converters, one with STDBY mode support
    • 6 separate 16-bit Sigma-Delta analog converters
  • Communication interfaces:
    • 18 LINFlexD modules
    • 10 deserial serial peripheral interface (DSPI) modules
    • 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support, one supporting time-triggered controller area network (TTCAN)
  • Two Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
  • Flexible Power Supply options:
    • External Regulators (1.2 V core, 3.3 V–5 V IO)
    • Single internal SMPS regulator (eLQFP176)
    • Single internal Linear Regulator with external ballast (FPBGA292)
  • Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
  • Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
Out of Stock
Quantity $ per unit Savings
1-9$38.310%
10-24$35.757%
25-99$34.2511%
100-249$31.0419%
250-499$29.9722%
500$28.4726%
Contact sales
$38.31
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius125.0
CoreDual e200z4d
ECCN US5A991.b.4.a
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeAutomotive Safety
Package NameLQFP 176 24x24x1.4

The data sheet provides electrical specifications, pin assignments, and package diagrams for the SPC5x series of microcontroller units (MCUs). For functional characteristics, see the SPC5x microcontroller reference manual.The SPC58xEx microcontroller is the first in a new family of devices...
Read More

Key features
  • AEC-Q100 qualified
  • 32-bit Power Architecture VLE compliant CPU cores:
    • Three main CPUs, dual issue, 32-bit CPU core complexes (e200z4), two of them having one checker core in lock-step
    • Floating Point, End-to-End Error Correction
  • 6576 KB (6288 KB code flash + 288 KB data flash) on-chip flash memory:
    • supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
    • Supports read while read between the two code Flash partitions.
  • 608 KB on-chip general-purpose SRAM (in addition to 160 KB core local data RAM)
  • 96-channel direct memory access controller (eDMA)
  • Comprehensive new generation ASIL-D safety concept:
    • ASIL-D of ISO 26262
    • FCCU for collection and reaction to failure notifications
    • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
    • Cyclic redundancy check (CRC) unit
  • Dual-channel FlexRay controller
  • Hardware Security Module (HSM)
  • Junction temperature range -40 °C to 165 °C
  • GTM 343 - Generic Timer Module:
    • Intelligent complex timer module
    • 144 channels (40 input and 104 output)
    • 5 programmable fine grain multi-threaded cores
    • 24-bit wide channels
  • Enhanced analog-to-digital converter system with:
    • 1 supervisor 12-bit SAR analog converter
    • 4 separate fast 12-bit SAR analog converters
    • 3 separate 10-bit SAR analog converters, one with STDBY mode support
    • 6 separate 16-bit Sigma-Delta analog converters
  • Communication interfaces:
    • 18 LINFlexD modules
    • 10 deserial serial peripheral interface (DSPI) modules
    • 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support, one supporting time-triggered controller area network (TTCAN)
  • Two Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
  • Flexible Power Supply options:
    • External Regulators (1.2 V core, 3.3 V–5 V IO)
    • Single internal SMPS regulator (eLQFP176)
    • Single internal Linear Regulator with external ballast (FPBGA292)
  • Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
  • Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART