SPC58EG80E5PEC0X

32-bit Power Architecture MCU for Automotive General Purpose Applications - Chorus family

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Dual e200z4d
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	TQFP 144 20x20x1.0

Description

The SPC584Gx, SPC58EGx, SPC58NGx microcontroller belongs to a family of devices superseding the SPC56x family. SPC584Gx, SPC58EGx, SPC58NGx build on the legacy of the SPC5x family, while introducing new features coupled with higher throughput to provide substantial reduction of cost per feature and...
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Key features

Key features
AEC-Q100 qualified High performance e200z4 triple core: 32-bit Power Architecture technology CPU Core frequency as high as 180 MHz Variable Length Encoding (VLE) Floating Point, End-to-End Error Correction 6582 KB (6144 KB code flash+ 256 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation Supports read while read between the two code Flash partitions. 608 KB on-chip general-purpose SRAM (in addition to 160 KB core local data RAM): 64KB in CPU_0, 64 KB in CPU_1 and 32 KB in CPU_2 182 KB HSM dedicated flash memory (144 KB code + 32 KB data) Multi-channel direct memory access controller (eDMA) one eDMA with 64 channels one eDMA with 32 channels 1 interrupt controller (INTC) Comprehensive new generation ASIL-D safety concept: ASIL-D of ISO 26262 One CPU channel in lockstep Logic BIST FCCU for collection and reaction to failure notifications Memory BIST Cyclic redundancy check (CRC) unit Memory Error Management Unit (MEMU) for collection and reporting of error events in memories Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC Body cross triggering unit (BCTU) Triggers ADC conversions from any eMIOS channel Triggers ADC conversions from up to 2 dedicated PIT_RTIs Enhanced modular IO subsystem (eMIOS): up to 64 timed IO channels with 16-bit counter resolution Enhanced analog-to-digital converter system with: 4 independent fast 12-bit SAR analog converters One supervisor 12-bit SAR analog converter One standby 10-bit SAR analog converter Communication interfaces: 18 LINFlexD modules 10 deserial serial peripheral interface (DSPI) modules 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support Dual-channel FlexRay controller Two independent Ethernet controllers 10/100Mbps compliant IEEE 802.3-2008 Low power capabilities Versatile low power modes Ultra low power standby with RTC Smart Wake-up Unit for contact monitoring Fast wakeup schemes Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus development interface (NDI) per IEEEISTO 5001-2003 standard, with some support for 2010 standard Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART Junction temperature range -40 °C to 150 °C

Out of Stock

Quantity	$ per unit	Savings
1-9	$32.28	0%
10-24	$29.77	8%
25-99	$28.44	12%
100-249	$25.43	21%
250-499	$24.26	25%
500	$23.09	28%
500 +	Contact sales

$32.28

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Dual e200z4d
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	TQFP 144 20x20x1.0

Description

Key features

Key features
AEC-Q100 qualified High performance e200z4 triple core: 32-bit Power Architecture technology CPU Core frequency as high as 180 MHz Variable Length Encoding (VLE) Floating Point, End-to-End Error Correction 6582 KB (6144 KB code flash+ 256 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation Supports read while read between the two code Flash partitions. 608 KB on-chip general-purpose SRAM (in addition to 160 KB core local data RAM): 64KB in CPU_0, 64 KB in CPU_1 and 32 KB in CPU_2 182 KB HSM dedicated flash memory (144 KB code + 32 KB data) Multi-channel direct memory access controller (eDMA) one eDMA with 64 channels one eDMA with 32 channels 1 interrupt controller (INTC) Comprehensive new generation ASIL-D safety concept: ASIL-D of ISO 26262 One CPU channel in lockstep Logic BIST FCCU for collection and reaction to failure notifications Memory BIST Cyclic redundancy check (CRC) unit Memory Error Management Unit (MEMU) for collection and reporting of error events in memories Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC Body cross triggering unit (BCTU) Triggers ADC conversions from any eMIOS channel Triggers ADC conversions from up to 2 dedicated PIT_RTIs Enhanced modular IO subsystem (eMIOS): up to 64 timed IO channels with 16-bit counter resolution Enhanced analog-to-digital converter system with: 4 independent fast 12-bit SAR analog converters One supervisor 12-bit SAR analog converter One standby 10-bit SAR analog converter Communication interfaces: 18 LINFlexD modules 10 deserial serial peripheral interface (DSPI) modules 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support Dual-channel FlexRay controller Two independent Ethernet controllers 10/100Mbps compliant IEEE 802.3-2008 Low power capabilities Versatile low power modes Ultra low power standby with RTC Smart Wake-up Unit for contact monitoring Fast wakeup schemes Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus development interface (NDI) per IEEEISTO 5001-2003 standard, with some support for 2010 standard Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART Junction temperature range -40 °C to 150 °C