SPC58NH92E7RMI0X

32-bit Power Architecture MCU for Automotive General Purpose Applications - Chorus family

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Triple core
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	LQFP 176 24x24x1.4

Description

The SPC58EHx, SPC58NHx microcontroller belongs to a family of devices superseding the SPC58x family. SPC58EHx, SPC58NHx builds on the legacy of the SPC5x family, while introducing new features coupled with higher throughput to provide substantial reduction of cost per feature and significant power...
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Key features

Key features
AEC-Q100 qualified High performance e200z4 triple core: 32-bit Power Architecture technology CPU Core frequency as high as 200 MHz Variable Length Encoding (VLE) Floating Point, End-to-End Error Correction 10496 KB (10240 KB code Flash + 256 KB data Flash) on-chip Flash memory: Supports read during program and erase operations, and multiple blocks allowing EEPROM emulation Supports read while read between the two code Flash partitions Hardware support for Flash context switching (for FOTA with multi software versions) 1088 KB on-chip general-purpose SRAM (in addition to 192 KB core local data RAM): 64 KB in CPU_0, 64 KB in CPU_1 and 64 KB in CPU_2 224 KB HSM dedicated Flash memory (192 KB code + 32 KB data) Multi-channel direct memory access controller (eDMA): One eDMA with 64 channels One eDMA with 16 channels One interrupt controller (INTC) Comprehensive new generation ASIL-D safety concept: ASIL-D of ISO 26262 One CPU channel in lockstep Logic BIST FCCU for collection and reaction to failure notifications Memory BIST Cyclic redundancy check (CRC) unit Memory Error Management Unit (MEMU) for collection and reporting of error events in memories Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC Body cross triggering unit (BCTU): Triggers ADC conversions from any eMIOS channel Triggers ADC conversions from up to 2 dedicated PIT_RTIs Enhanced modular IO subsystem (eMIOS): up to 96 timed IO channels with 16-bit counter resolution Enhanced analog-to-digital converter system with: 4 independent fast 12-bit SAR analog converters One supervisor 12-bit SAR analog converter One standby 10-bit SAR analog converter 100 ADC channels Communication interfaces: 24 LINFlexD modules 10 deserial serial peripheral interface (DSPI) modules 1 deserial serial peripheral interface (DSPI_LP) module available in low power mode 16 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support Dual-channel FlexRay controller One SD/SDIO/eMMC module One OctalSPI module with double Chip Select Two independent Ethernet controllers, one 10/100Mbps and the other one 10/100Mbps or 1Gbps, compliant IEEE 802.3-2008 and OPEN RGMII EPL v2.3 Four I2C modules Two PSI5 modules Low power capabilities: Versatile low power modes Ultra low power standby with RTC Smart Wake-up Unit for contact monitoring Fast wakeup schemes Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART Low power supply options: Single internal linear regulator with external ballast External low voltage supply (1.2V) Temperature range: -40 °C to 105 °C -40 °C to 125 °C

In stock

Quantity	$ per unit	Savings
1-9	$42.42	0%
10-24	$35.40	17%
25-49	$33.92	20%
50-99	$33.89	20%
100-249	$30.73	28%
250-499	$29.67	30%
500	$28.38	33%
500 +	Contact sales

$42.42

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Triple core
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	LQFP 176 24x24x1.4

Description

Key features

Key features
AEC-Q100 qualified High performance e200z4 triple core: 32-bit Power Architecture technology CPU Core frequency as high as 200 MHz Variable Length Encoding (VLE) Floating Point, End-to-End Error Correction 10496 KB (10240 KB code Flash + 256 KB data Flash) on-chip Flash memory: Supports read during program and erase operations, and multiple blocks allowing EEPROM emulation Supports read while read between the two code Flash partitions Hardware support for Flash context switching (for FOTA with multi software versions) 1088 KB on-chip general-purpose SRAM (in addition to 192 KB core local data RAM): 64 KB in CPU_0, 64 KB in CPU_1 and 64 KB in CPU_2 224 KB HSM dedicated Flash memory (192 KB code + 32 KB data) Multi-channel direct memory access controller (eDMA): One eDMA with 64 channels One eDMA with 16 channels One interrupt controller (INTC) Comprehensive new generation ASIL-D safety concept: ASIL-D of ISO 26262 One CPU channel in lockstep Logic BIST FCCU for collection and reaction to failure notifications Memory BIST Cyclic redundancy check (CRC) unit Memory Error Management Unit (MEMU) for collection and reporting of error events in memories Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC Body cross triggering unit (BCTU): Triggers ADC conversions from any eMIOS channel Triggers ADC conversions from up to 2 dedicated PIT_RTIs Enhanced modular IO subsystem (eMIOS): up to 96 timed IO channels with 16-bit counter resolution Enhanced analog-to-digital converter system with: 4 independent fast 12-bit SAR analog converters One supervisor 12-bit SAR analog converter One standby 10-bit SAR analog converter 100 ADC channels Communication interfaces: 24 LINFlexD modules 10 deserial serial peripheral interface (DSPI) modules 1 deserial serial peripheral interface (DSPI_LP) module available in low power mode 16 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support Dual-channel FlexRay controller One SD/SDIO/eMMC module One OctalSPI module with double Chip Select Two independent Ethernet controllers, one 10/100Mbps and the other one 10/100Mbps or 1Gbps, compliant IEEE 802.3-2008 and OPEN RGMII EPL v2.3 Four I2C modules Two PSI5 modules Low power capabilities: Versatile low power modes Ultra low power standby with RTC Smart Wake-up Unit for contact monitoring Fast wakeup schemes Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART Low power supply options: Single internal linear regulator with external ballast External low voltage supply (1.2V) Temperature range: -40 °C to 105 °C -40 °C to 125 °C