ST33HTPH2E28AHD0

ST33HTPH2E28AHD0

ST33HTPH2E32AHD0

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Trusted Platform Module 1.2 & 2.0 with TCG SPI interface

Quantity $ per Unit Savings
1 - 9$2.820%
10 - 99$2.4912%
100 - 249$2.2321%
250 - 499$2.1624%
500$2.1524%
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Out of stock
$2.82
Parameter NameParameter Value
Supply Voltage Min Volt1.62
Supply Voltage Max Volt3.6
Operating Temp Min Celsius0.0
Operating Temp Max Celsius70.0
CoreArm Sc300
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
ROHS Compliance GradeEcopack2
GradeIndustrial
Package NameVFQFPN 32 5x5x1.0 mm
Key features
  • TPM features
    • Flash-memory-based Trusted Platform Module (TPM)
    • Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0 command set
    • Supporting dynamic switch from one mode to another and capability to lock one mode irreversibly
    • For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.3
    • For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
    • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
    • Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0 protection profiles at EAL4+
    • FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0
    • SPI support for up to 33 MHz in FIFO and CRB protocol modes
    • Support for software and hardware physical presence for TPM 1.2 and TPM 2.0
  • Hardware features
    • Arm® SecurCore® SC300™ 32-bit RISC core
    • Highly reliable Flash memory technology
    • Extended temperature range: −40 °C to 105 °C
    • ESD (electrostatic discharge) protection up to 4 kV (HBM)
    • 1.8 V or 3.3 V supply voltage range

    • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
  • Security features
    • Active shield and environmental sensors
    • Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2 and TPM 2.0 modes
    • Monitoring of environmental parameters (power)
    • Hardware and software protection against fault injection
    • FIPS compliant RNG built on an SP800-90A comp