ST33HTPH2E32AHD0

Trusted Platform Module 1.2 & 2.0 with TCG SPI interface

Parameters

Supply Voltage Min Volt	1.62
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	0.0
Operating Temp Max Celsius	70.0
Core	Arm Sc300
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	VFQFPN 32 5x5x1.0 mm

Description

The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services...
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Key features

Key features
TPM features Flash-memory-based Trusted Platform Module (TPM) Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0 command set Supporting dynamic switch from one mode to another and capability to lock one mode irreversibly For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.3 For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03 TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0 protection profiles at EAL4+ FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0 SPI support for up to 33 MHz in FIFO and CRB protocol modes Support for software and hardware physical presence for TPM 1.2 and TPM 2.0 Hardware features Arm^® SecurCore^® SC300™ 32-bit RISC core Highly reliable Flash memory technology Extended temperature range: −40 °C to 105 °C ESD (electrostatic discharge) protection up to 4 kV (HBM) 1.8 V or 3.3 V supply voltage range 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages Security features Active shield and environmental sensors Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2 and TPM 2.0 modes Monitoring of environmental parameters (power) Hardware and software protection against fault injection FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG) Cryptographic algorithms: RSA key generation (1024 or 2048 bits) RSA signature and encryption HMAC SHA-1 & SHA-256 AES-128-192-256 ECC 224 & 256 bits Product compliance TPM 1.2 compliant with Microsoft^® Windows^® 7, 8.1 and 10 TPM 2.0 compliant with Microsoft Windows 10 Compliant with Intel^® TXT for TPM1.2 and TPM 2.0 in SPI FIFO mode TPM 1.2 and TPM 2.0 compliant with the respective TCG test suites

In stock

Quantity	$ per unit	Savings
1-25	$4.60	0%
25 +	Contact sales

$4.60

Parameters

Supply Voltage Min Volt	1.62
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	0.0
Operating Temp Max Celsius	70.0
Core	Arm Sc300
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	VFQFPN 32 5x5x1.0 mm

Description

Key features

Key features
TPM features Flash-memory-based Trusted Platform Module (TPM) Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0 command set Supporting dynamic switch from one mode to another and capability to lock one mode irreversibly For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.3 For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03 TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0 protection profiles at EAL4+ FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0 SPI support for up to 33 MHz in FIFO and CRB protocol modes Support for software and hardware physical presence for TPM 1.2 and TPM 2.0 Hardware features Arm^® SecurCore^® SC300™ 32-bit RISC core Highly reliable Flash memory technology Extended temperature range: −40 °C to 105 °C ESD (electrostatic discharge) protection up to 4 kV (HBM) 1.8 V or 3.3 V supply voltage range 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages Security features Active shield and environmental sensors Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2 and TPM 2.0 modes Monitoring of environmental parameters (power) Hardware and software protection against fault injection FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG) Cryptographic algorithms: RSA key generation (1024 or 2048 bits) RSA signature and encryption HMAC SHA-1 & SHA-256 AES-128-192-256 ECC 224 & 256 bits Product compliance TPM 1.2 compliant with Microsoft^® Windows^® 7, 8.1 and 10 TPM 2.0 compliant with Microsoft Windows 10 Compliant with Intel^® TXT for TPM1.2 and TPM 2.0 in SPI FIFO mode TPM 1.2 and TPM 2.0 compliant with the respective TCG test suites