ST4SI1M0008SCIFW

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SIM & eSIM for secure M2M industrial applications with Soracom connectivity

Quantity $ per Unit Savings
1 - 500$0.000%
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Parameter NameParameter Value
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN US3A991A2
ECCN EUNEC
Packing TypeTape And Reel
ROHS Compliance GradeN/A
GradeIndustrial
Package NameVFDFPN 8 5X6 WETTABLE FLANK
Key features
    • Cellular network connectivity configuration provided by trusted partners
    • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
    • Network access applications supported: SIM / USIM / ISIM / CSIM
    • Secure element access control (ARF / PKCS#15)
    • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
    • Multi-interfaces able to combine (U)SIM + eSE
  • Hardware
    • Product available on ST33G1M2M
    • ST33 product based on a 32-bit Arm® SecurCore® SC300 RISC core
    • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
    • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
    • Serial peripheral interface (SPI), depending on packages
    • Industrial qualification (JEDEC JESD47)
    • Operating temperature: -40°C to +105°C
    • Common Criteria EAL5+
  • ECOPACK-compliant packages
    • 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
    • DFN8 with wettable flanks (MFF2)
    • WLCSP11
  • Security
    • Symmetric cryptography DES / 3DES / AES
    • Asymmetric cryptography RSA (up to 2048 bits)
    • HTTPS remote management TLS v1.0, v1.1 and v1.2
    • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
    • Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE
  • Software standard compliancy
    • Java® Card v3.0.4 Classic
    • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
    • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)
    • Power saving features (PSM and eDRX) defined by ETSI release 13