ST4SI2M0007AKIFW

GSMA eSIM M2M for secure industrial applications with Arkessa connectivity

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	VFDFPN 8 5X6 WETTABLE FLANK

Description

The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all industrial devices.It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.The device can manage different MNO profiles while ensuring the appropriate...
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Key features

Key features
Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications Bootstrap connectivity profile provided by a trusted partner Up to 7 connectivity profiles (depending on memory size) Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks Network access applications supported: SIM / USIM / ISIM / CSIM Secure element access control (ARF / PKCS#15) OTA capability over SMS, CAT-TP & HTTPS (including DNS) Multi-interfaces able to combine eSIM + eSE Hardware Product available on ST33G1M2M ST33 product based on a 32-bit Arm^® SecurCore^® SC300^™ RISC core Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V) Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol) Serial peripheral interface (SPI), depending on packages Industrial qualification (JEDEC JESD47) Operating temperature: -40°C to +105°C Common Criteria EAL5+ ECOPACK-compliant packages 2FF, 3FF or 4FF plugin card (based on D16 micromodule) VFDFPN8 5 × 6 mm, wettable flank (MFF2) WLCSP11 Security Symmetric cryptography DES / 3DES / AES Asymmetric cryptography RSA (up to 2048 bits) HTTPS remote management TLS v1.0, v1.1 and v1.2 Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1 Authentication algorithm: MILENAGE, TUAK, CAVE Software standard compliance GSMA SGP.02 v3.2 SIMalliance interoperable profile v2.1 Java^® Card v3.0.4 Classic GlobalPlatform^® card specification v2.2, including GP amendments A, B, C, D and E ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office) Power saving features (PSM and eDRX) defined by ETSI release 13 Certification GlobalPlatform^®-certified Muse eUICC-i2 v1 compliant with GSMA SGP.02 v3.2

Out of Stock

Quantity	$ per unit	Savings
1-500	$4.96	0%
500 +	Contact sales

$4.96

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	VFDFPN 8 5X6 WETTABLE FLANK

Description

Key features

Key features
Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications Bootstrap connectivity profile provided by a trusted partner Up to 7 connectivity profiles (depending on memory size) Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks Network access applications supported: SIM / USIM / ISIM / CSIM Secure element access control (ARF / PKCS#15) OTA capability over SMS, CAT-TP & HTTPS (including DNS) Multi-interfaces able to combine eSIM + eSE Hardware Product available on ST33G1M2M ST33 product based on a 32-bit Arm^® SecurCore^® SC300^™ RISC core Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V) Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol) Serial peripheral interface (SPI), depending on packages Industrial qualification (JEDEC JESD47) Operating temperature: -40°C to +105°C Common Criteria EAL5+ ECOPACK-compliant packages 2FF, 3FF or 4FF plugin card (based on D16 micromodule) VFDFPN8 5 × 6 mm, wettable flank (MFF2) WLCSP11 Security Symmetric cryptography DES / 3DES / AES Asymmetric cryptography RSA (up to 2048 bits) HTTPS remote management TLS v1.0, v1.1 and v1.2 Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1 Authentication algorithm: MILENAGE, TUAK, CAVE Software standard compliance GSMA SGP.02 v3.2 SIMalliance interoperable profile v2.1 Java^® Card v3.0.4 Classic GlobalPlatform^® card specification v2.2, including GP amendments A, B, C, D and E ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office) Power saving features (PSM and eDRX) defined by ETSI release 13 Certification GlobalPlatform^®-certified Muse eUICC-i2 v1 compliant with GSMA SGP.02 v3.2