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ST4SI2S0029TPI84

GSMA eSIM system-on-chip for secure M2M industrial applications

Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeNot Available
RoHs compliantEcopack1
GradeIndustrial
Package NameSINGLE CARD

The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all industrial devices.It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.The device can manage different MNO profiles while ensuring the appropriate...
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Key features
    • Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
    • Bootstrap connectivity profile provided by a trusted partner
    • Up to 7 connectivity profiles (depending on memory size)
    • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
    • Network access applications supported: SIM / USIM / ISIM / CSIM
    • Secure element access control (ARF / PKCS#15)
    • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
    • Multi-interfaces able to combine eSIM + eSE
  • Hardware
    • Product available on ST33G1M2M
    • ST33 product based on a 32-bit Arm® SecurCore® SC300 RISC core
    • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
    • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
    • Serial peripheral interface (SPI), depending on packages
    • Industrial qualification (JEDEC JESD47)
    • Operating temperature: -40°C to +105°C
    • Common Criteria EAL5+
  • ECOPACK-compliant packages
    • 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
    • VFDFPN8 5 × 6 mm, wettable flank (MFF2)
    • WLCSP11
  • Security
    • Symmetric cryptography DES / 3DES / AES
    • Asymmetric cryptography RSA (up to 2048 bits)
    • HTTPS remote management TLS v1.0, v1.1 and v1.2
    • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
    • Authentication algorithm: MILENAGE, TUAK, CAVE
  • Software standard compliance
    • GSMA SGP.02 v3.2
    • SIMalliance interoperable profile v2.1
    • Java® Card v3.0.4 Classic
    • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
    • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)
    • Power saving features (PSM and eDRX) defined by ETSI release 13
  • Certification
    • GlobalPlatform®-certified Muse eUICC-i2 v1 compliant with GSMA SGP.02 v3.2
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Quantity $ per unit Savings
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Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeNot Available
RoHs compliantEcopack1
GradeIndustrial
Package NameSINGLE CARD

The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all industrial devices.It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.The device can manage different MNO profiles while ensuring the appropriate...
Read More

Key features
    • Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
    • Bootstrap connectivity profile provided by a trusted partner
    • Up to 7 connectivity profiles (depending on memory size)
    • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
    • Network access applications supported: SIM / USIM / ISIM / CSIM
    • Secure element access control (ARF / PKCS#15)
    • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
    • Multi-interfaces able to combine eSIM + eSE
  • Hardware
    • Product available on ST33G1M2M
    • ST33 product based on a 32-bit Arm® SecurCore® SC300 RISC core
    • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
    • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
    • Serial peripheral interface (SPI), depending on packages
    • Industrial qualification (JEDEC JESD47)
    • Operating temperature: -40°C to +105°C
    • Common Criteria EAL5+
  • ECOPACK-compliant packages
    • 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
    • VFDFPN8 5 × 6 mm, wettable flank (MFF2)
    • WLCSP11
  • Security
    • Symmetric cryptography DES / 3DES / AES
    • Asymmetric cryptography RSA (up to 2048 bits)
    • HTTPS remote management TLS v1.0, v1.1 and v1.2
    • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
    • Authentication algorithm: MILENAGE, TUAK, CAVE
  • Software standard compliance
    • GSMA SGP.02 v3.2
    • SIMalliance interoperable profile v2.1
    • Java® Card v3.0.4 Classic
    • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
    • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)
    • Power saving features (PSM and eDRX) defined by ETSI release 13
  • Certification
    • GlobalPlatform®-certified Muse eUICC-i2 v1 compliant with GSMA SGP.02 v3.2