ST4SI3M004600HFW

GSMA eSIM for IoT system-on-chip solution for IoT environment

Parameters

ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	VFDFPN 8 5X6 WETTABLE FLANK

Description

The ST4SIM-300M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all IoT devices.It is compliant with the GSM Association (GSMA) specification SGP.32 v1.2.The ST4SIM-300M can remotely manage profiles of different MNOs while ensuring the appropriate security...
Read More

Key features

Key features
Remote SIM provisioning compliant with GSMA eSIM for IoT and TCA specifications Bootstrap connectivity profile provided by a trusted partner Compliant with 4G (LTE) / CDMA / NB-IOT / CAT–M networks Network access applications supported: SIM / USIM / ISIM / CSIM Secure element access control (ARF / PKCS#15) OTA capability over SMS, CAT-TP and HTTPS (including DNS) Multi-Interfaces able to combine eSIM + eSE Hardware Product available on ST33K1M5M ST33 product based on a 32-bit Arm^® Cortex^®-M35P CPU core Supply voltage: Supply voltage ranges: 1.8 V, 3 V Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol) Serial peripheral interface (SPI) or I²C, depending on packages Industrial qualification (JEDEC JESD47) Operating temperature: -40°C to +105°C Common Criteria EAL6+ ECOPACK-compliant packages Card plugin 2FF, 3FF, or 4FF VFDFPN8 5 × 6 mm, wettable flank (MFF2) WLCSP24 Security Symmetric cryptography DES / 3DES / AES Asymmetric cryptography RSA (up to 2048 bits) HTTPS remote management TLS v1.0, v1.1 and v1.2 Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1 Authentication algorithm: MILENAGE, TUAK, CAVE and XOR Software standard compliancy GSMA SGP.32 v1.2 TCA interoperable profile v3.3.1 Java^® Card v3.0.5 Classic GlobalPlatform^® card specification v2.3, including amendments B, C, D, F, and H GlobalPlatform^® enhancement with SCP11, ELF upgrade OS update mechanism ETSI, 3GPP and 3GPP2 release 17 (API Rel16) Power saving features (PSM & eDRX) defined by ETSI release 17

In stock

Quantity	$ per unit	Savings
1-9	$5.38	0%
10-24	$3.70	31%
25-99	$3.45	36%
100-249	$3.04	44%
250-499	$2.88	46%
500	$2.59	52%
500 +	Contact sales

$5.38

Parameters

ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	VFDFPN 8 5X6 WETTABLE FLANK

Description

Key features

Key features
Remote SIM provisioning compliant with GSMA eSIM for IoT and TCA specifications Bootstrap connectivity profile provided by a trusted partner Compliant with 4G (LTE) / CDMA / NB-IOT / CAT–M networks Network access applications supported: SIM / USIM / ISIM / CSIM Secure element access control (ARF / PKCS#15) OTA capability over SMS, CAT-TP and HTTPS (including DNS) Multi-Interfaces able to combine eSIM + eSE Hardware Product available on ST33K1M5M ST33 product based on a 32-bit Arm^® Cortex^®-M35P CPU core Supply voltage: Supply voltage ranges: 1.8 V, 3 V Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol) Serial peripheral interface (SPI) or I²C, depending on packages Industrial qualification (JEDEC JESD47) Operating temperature: -40°C to +105°C Common Criteria EAL6+ ECOPACK-compliant packages Card plugin 2FF, 3FF, or 4FF VFDFPN8 5 × 6 mm, wettable flank (MFF2) WLCSP24 Security Symmetric cryptography DES / 3DES / AES Asymmetric cryptography RSA (up to 2048 bits) HTTPS remote management TLS v1.0, v1.1 and v1.2 Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1 Authentication algorithm: MILENAGE, TUAK, CAVE and XOR Software standard compliancy GSMA SGP.32 v1.2 TCA interoperable profile v3.3.1 Java^® Card v3.0.5 Classic GlobalPlatform^® card specification v2.3, including amendments B, C, D, F, and H GlobalPlatform^® enhancement with SCP11, ELF upgrade OS update mechanism ETSI, 3GPP and 3GPP2 release 17 (API Rel16) Power saving features (PSM & eDRX) defined by ETSI release 17