ST67W611M1A6UTR

Low-power Wi-Fi 6 & Bluetooth LE combo coprocessor module

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
Operating Voltage Min Volt	2.97
Operating Voltage Max Volt	3.63
ECCN US	5A992.c
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	SIP LGA 32L 12.28 X 12.28 X 2.4

Description

This all‑in-one design and capability contribute to reduced costs and enhanced performance, making it an attractive choice for IoT edge devices requiring a single‑chip solution.ST67W611M1 operates as an IoT connectivity transceiver, with an external STM32 host MCU running...
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Key features

Key features
Module content All-in-one Wi‑Fi^®/Bluetooth^® LE wireless microcontroller Embedded 40 MHz high-precision crystal All RF components for transmission and reception matching network, including antenna filter Three variants: embedded antenna (-B version), RF connector (-U version), RF pin (-P version) Standard IEEE 802.11b/g/n/ax Bluetooth^® LE 5.4 Regulatory certifications: CE/RED, UKCA, FCC, IC, JRF/ARIB, ACMA/RSM, RCM, BIS/WPC, NBTC, RoHS, REACH Wi-Fi and Bluetooth LE can run concurrently dynamically Wi-Fi Wi-Fi 6, 2.4 GHz RF transceiver Wi-Fi 20/40 MHz bandwidth, 1T1R Wi-Fi security WPS/WEP/WPA/WPA2/WPA3 STA, SoftAP, concurrent STA + SoftAP Maximum Tx power (11b 1 Mbps): 21 dBm Tx power (HE40 and MCS9): 16 dBm Rx sensitivity (HE40 and MCS9): -67 dBm Application throughput up to 17 Mbps (TCP) LDPC, STBC, beamforming, DL/UL OFDMA, MU-MIMO, target wake time (TWT), spatial reuse (SR), dual carrier modulation (DCM), extended range (ER) A-MPDU, A-MSDU, immediate block ACK, fragmentation, and defragmentation Bluetooth^® LE Maximum Tx power: + 10 dBm Rx sensitivity Bluetooth^® LE (2 Mbps): -96.5 dBm Bluetooth^® LE (1 Mbps): -99 dBm System peripherals SPI UART Security PSA Level 1 certified Security system encryption engine Secure services: Secure boot and FOTA (firmware over-the-air) Voltage Input voltage: 3.3 V I/O voltage: 1.8 V/3.3 V Environmental specifications Temperature: Operating: -40°C ~ +85°C Storage: -40°C ~ +125°C Humidity: Relative: < 90% noncondensing Storage: < 90% noncondensing All packages are ECOPACK2 compliant.

In stock

Quantity	$ per unit	Savings
1-9	$7.15	0%
10-24	$6.21	13%
25-99	$5.88	18%
100-249	$5.42	24%
250-499	$5.15	28%
500	$4.90	31%
500 +	Contact sales

$7.15

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
Operating Voltage Min Volt	2.97
Operating Voltage Max Volt	3.63
ECCN US	5A992.c
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	SIP LGA 32L 12.28 X 12.28 X 2.4

Description

Key features

Key features
Module content All-in-one Wi‑Fi^®/Bluetooth^® LE wireless microcontroller Embedded 40 MHz high-precision crystal All RF components for transmission and reception matching network, including antenna filter Three variants: embedded antenna (-B version), RF connector (-U version), RF pin (-P version) Standard IEEE 802.11b/g/n/ax Bluetooth^® LE 5.4 Regulatory certifications: CE/RED, UKCA, FCC, IC, JRF/ARIB, ACMA/RSM, RCM, BIS/WPC, NBTC, RoHS, REACH Wi-Fi and Bluetooth LE can run concurrently dynamically Wi-Fi Wi-Fi 6, 2.4 GHz RF transceiver Wi-Fi 20/40 MHz bandwidth, 1T1R Wi-Fi security WPS/WEP/WPA/WPA2/WPA3 STA, SoftAP, concurrent STA + SoftAP Maximum Tx power (11b 1 Mbps): 21 dBm Tx power (HE40 and MCS9): 16 dBm Rx sensitivity (HE40 and MCS9): -67 dBm Application throughput up to 17 Mbps (TCP) LDPC, STBC, beamforming, DL/UL OFDMA, MU-MIMO, target wake time (TWT), spatial reuse (SR), dual carrier modulation (DCM), extended range (ER) A-MPDU, A-MSDU, immediate block ACK, fragmentation, and defragmentation Bluetooth^® LE Maximum Tx power: + 10 dBm Rx sensitivity Bluetooth^® LE (2 Mbps): -96.5 dBm Bluetooth^® LE (1 Mbps): -99 dBm System peripherals SPI UART Security PSA Level 1 certified Security system encryption engine Secure services: Secure boot and FOTA (firmware over-the-air) Voltage Input voltage: 3.3 V I/O voltage: 1.8 V/3.3 V Environmental specifications Temperature: Operating: -40°C ~ +85°C Storage: -40°C ~ +125°C Humidity: Relative: < 90% noncondensing Storage: < 90% noncondensing All packages are ECOPACK2 compliant.