STA1385EOAS1 Active

Telemaco3P automotive family of telematics and connectivity microprocessor
Supply Voltage Min Volt1.14
Supply Voltage Max Volt1.21
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
CoreDual Arm Cortex-A7
Packing TypeTray
ROHS Compliance GradeEcopack2
Package NameLFBGA 361 16x16x1.7
Key Features
  • AEC-Q100 qualified Grade 2 Core and Infrastructure
  • Dual ARM CortexA7 up to 600 MHz, withMMU, FPU and NEON support
  • Memory organization:Embedded Vehicle Interface
    • L1 Cache: 32 KB I, 32 KB D
    • L2 Cache: 256 KB
    • Total embedded SRAM: 768 KB
  • Isolated Cortex-M3 core
    • L1 Cache: 8 KB I
  • 256 KB reserved embedded SRAM (extendible to 768 KB)
  • 1x CAN Standard (C_CAN)
  • 2x CAN FD (M_CAN)
  • 1x Flexray
  • 1x SD/MMC/SDIO SDR50 (SD/MMC0)
  • 1x SD/MMC/SDIO SDR25 (SD/MMC1)
  • 1x USB 2.0 DR with HS PHY and HSIC
  • 1x USB 2.0 DR with HS PHY
  • HIS SHE/SHE+ Service Set with extensions for PKC (SHE_EXT)
  • Cryptographic Functions Accelerators
    • Symmetric keys: MP AES
    • Public keys: RSA, ECC
    • Hash: MD5, SHA1, SHA2
  • True Random Number Generator
  • User pogrammable OTP memory (eHSM OTP)
  • 16-bit DDR3L-1066 (533 MHz)
  • 16-bit LPDDR2-800 (400 MHz)
  • SQI Interface
  • 8-bit Parallel NAND (1 chip select)
  • 1x 6-channel 10-bits ADC
  • 3x I2C multi-master/slave interfaces
  • 6x UART controller
  • 3xI2S audio interfaces
  • 3x Synchronous Serial Port (SSP/SPI)
  • 5x 32-bit GPIO ports
  • JTAG based in-circuit emulator (ICE) with Embedded Trace Module
  • VDD, VDD_ARM: 1.14 V-1.21 V
  • VDD_IO_3V3: 3.3 V ±10%
  • VDD_IO_SDMMC0: 1.8 V-3.3 V ±10%
  • VDD_IO_BOOT: 1.8 V/3.3 V ±10%
  • VDD_IO_ON: 3.3 V ± 10%
  • VDDQ: 1.35 V ± 5% (DDR3L)
  • Junction temperature range: -40 C/ +150 C

STA1385 is a fully automotive, power efficient System-On-Chip, targeting cost effective processing solutions for innovative Telematics and Connectivity applications including Cyber-security protection.

It features a powerful Dual ARM Cortex-A7 processor, an embedded and independent Hardware Security Module (HSM), an isolated sub-system based on ARM Cortex-M3 for vehicle CAN interface and a full set of standard connectivity interfaces, including a dual Gbit ETH AVB controller and Flexray.

Out of stock
Range Unit Price Savings
1 - 500$0.000%
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