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The device is a low-power three-axis angular rate sensor.
It includes a sensing element and an IC interface capable of providing the measured angular rate to the external world via three analog outputs.
The sensing element is manufactured using a dedicated micro-machining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.
The device is available in a plastic land grid array (LGA) package and can operate within a temperature range from -40 °C to +85 °C.