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    STAC4932F1MR

    350 W 50 V HF/VHF DMOS in STAC moisture-resistant flangeless package

    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Packing TypeLoose Piece
    RoHs compliantEcopack1
    GradeIndustrial
    Package NameSTAC780-4F
    Description

    The STAC4932F1MR is an N-channel MOS fieldeffect RF power transistor. It is intended for use in 50 V / 80 V ISM applications up to 250 MHz.The STAC4932F1MR benefits from the latest generation of environmentally designed packaging, ruggedized against cyclic high moisture operation and severe storage...
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    Key features
    Key features
    • Improved ruggedness V(BR)DSS > 200 V
    • Load mismatch 65:1 all phases @ 350 W - 50 V - 123 MHz
    • POUT = 450 W typ. with 24 dB gain at 123 MHz
    • In compliance with the 2002/95/EC European directive
    • Moisture resistant package specifically designed to operate in extreme environments
    • Drying recommendation before soldering:
      • 48 hrs at 125 °C
    • Back finishing:
      • Sn96.5/Ag3/Cu0.5 solder
      • Base flatness < 0.2 mm
      • Gold content < 0.1%
      • Minimum solder thickness > 2 μm
    Out of Stock
    Quantity $ per unit Savings
    1-500$0.000%
    500 + Contact sales
    $0.00
    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Packing TypeLoose Piece
    RoHs compliantEcopack1
    GradeIndustrial
    Package NameSTAC780-4F
    Description

    The STAC4932F1MR is an N-channel MOS fieldeffect RF power transistor. It is intended for use in 50 V / 80 V ISM applications up to 250 MHz.The STAC4932F1MR benefits from the latest generation of environmentally designed packaging, ruggedized against cyclic high moisture operation and severe storage...
    Read More

    Key features
    Key features
    • Improved ruggedness V(BR)DSS > 200 V
    • Load mismatch 65:1 all phases @ 350 W - 50 V - 123 MHz
    • POUT = 450 W typ. with 24 dB gain at 123 MHz
    • In compliance with the 2002/95/EC European directive
    • Moisture resistant package specifically designed to operate in extreme environments
    • Drying recommendation before soldering:
      • 48 hrs at 125 °C
    • Back finishing:
      • Sn96.5/Ag3/Cu0.5 solder
      • Base flatness < 0.2 mm
      • Gold content < 0.1%
      • Minimum solder thickness > 2 μm