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STEVAL-G0707TOCB

Evaluation board for half-bridge with SGT070R70HTO, 53 mOhm typ., 26 A e-mode PowerGaN transistor

Operating RangeIndustrial
Core ProductSTGAP2GSNCTR, SGT070R70HTO
ECCN USEAR99
ECCN EUNEC
Packing TypeNot Applicable
RoHs compliantEcopack2
GradeIndustrial
Package NameCARD

The STEVAL-G0707TOCB is designed for evaluating the electrical and thermal characteristics of the SGT070R70HTO 700-V e-mode PowerGaN transistor using the isolated gate driver STGAP2GS.The half-bridge configuration enables the emulation of buck, boost, PFC, and inverter topologies with a dedicated...
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Key features
  • Half-bridge topology featuring 630 V peak voltage
  • Equipped with 700 V, 53 mΩ typ., 26 A, e-mode PowerGaN transistor
  • Bottom solder mask aperture for high heat-sink performance
  • 8° C/W junction-to-heatsink thermal resistance to evaluate large power topologies
  • -3.0 VCC/+6.2 VCC gate driver supply voltage
  • On-board adjustable deadtime generator to convert single PWM signals into independent high-side and low-side signals with deadtimes from 10 ns to 150 ns
  • Dedicated input connector for external deadtime PWM
  • Up to 1 MHz switching frequency operation
  • MMCX high frequency connector for high side GaN gate voltage measurement
  • 5.08 mm pitch for GaN drain-source voltage monitoring
  • Optional low-side shunt for transistor source current monitoring
Coming Soon
Operating RangeIndustrial
Core ProductSTGAP2GSNCTR, SGT070R70HTO
ECCN USEAR99
ECCN EUNEC
Packing TypeNot Applicable
RoHs compliantEcopack2
GradeIndustrial
Package NameCARD

The STEVAL-G0707TOCB is designed for evaluating the electrical and thermal characteristics of the SGT070R70HTO 700-V e-mode PowerGaN transistor using the isolated gate driver STGAP2GS.The half-bridge configuration enables the emulation of buck, boost, PFC, and inverter topologies with a dedicated...
Read More

Key features
  • Half-bridge topology featuring 630 V peak voltage
  • Equipped with 700 V, 53 mΩ typ., 26 A, e-mode PowerGaN transistor
  • Bottom solder mask aperture for high heat-sink performance
  • 8° C/W junction-to-heatsink thermal resistance to evaluate large power topologies
  • -3.0 VCC/+6.2 VCC gate driver supply voltage
  • On-board adjustable deadtime generator to convert single PWM signals into independent high-side and low-side signals with deadtimes from 10 ns to 150 ns
  • Dedicated input connector for external deadtime PWM
  • Up to 1 MHz switching frequency operation
  • MMCX high frequency connector for high side GaN gate voltage measurement
  • 5.08 mm pitch for GaN drain-source voltage monitoring
  • Optional low-side shunt for transistor source current monitoring