Active

STHVUP32

32 channels ±100 V, ±0.4/0.8 A, 3/5-level RTZ, TR switch, high-speed ultrasound pulser with integrated transmit beamformer

ECCN USEAR99
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameFCBGA168 11.5X10.5X1.35 0.8P

The STHVUP32 is a 32 channels monolithic high-voltage and high-speed pulser with an integrated beam-former. It is specifically designed for pulse generation in multi-channel low power ultra-portable medical ultrasound applications.The waveforms generated by STHVUP32 are described with sequences of...
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Key features
  • Pulsed wave (PW) and continuous wave (CW) mode operations:
    • 3- or 5-level ±100 V output waveform
    • Programmable ±200 mA or ±400 mA or ±600 mA or
      ±800 mA source and sink current in 3-level
      configuration (±400 mA or ±200 mA in 5-level
      configuration)
  • Fully integrated 23 Ω resistance real clamping-to-ground function
  • Fully integrated 23 Ω resistance transmitting/receiving switches (TR_SW)
    • Compliant with receiver multiplexing
      function
  • Auxiliary integrated circuits
    • Noise-blocking diodes
    • Thermal protection
    • Undervoltage protection and bias supply
      checks
  • Programmable power management to optimize the performances for ultra-portable applications
  • Beamforming in transmission mode
    • Programmable single-channel delay for beam
      steering and focusing
    • Clock frequency up to 200 MHz
    • 5 ns delay resolution
    • From 5 ns to 20 us delay range @ 200 MHz
    • 3 us minimum delay table writing time
  • Embedded memory to store transmission patterns
    • 32 states for waveform definition, with
      waveform compression algorithm
    • Up to 4 different waveforms for each channel
  • Easy driving control
    • Control through standard Quad Serial
      Peripheral Interface (QSPI)
    • Few input signals to drive several devices
    • Single interrupt as alert signal
    • Single trigger to manage transmitting (TX) and
      receiving (RX) phases, fully automatic and
      programmable
    • Anti-glitch on TRIGGER signal during TX
      phase
  • Checksum control
  • Very low package thermal resistance
  • Latch-up free due to HV SOI technology
  • Just a few passive components needed
  • Small package: BGA 11.5 mm x 10.5 mm x 1.35 mm with 168 balls and 0.8 mm pitch
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Quantity $ per unit Savings
1-9$112.700%
10-24$106.890%
25-99$103.970%
100-249$99.460%
250-500$96.040%
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ECCN USEAR99
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameFCBGA168 11.5X10.5X1.35 0.8P

The STHVUP32 is a 32 channels monolithic high-voltage and high-speed pulser with an integrated beam-former. It is specifically designed for pulse generation in multi-channel low power ultra-portable medical ultrasound applications.The waveforms generated by STHVUP32 are described with sequences of...
Read More

Key features
  • Pulsed wave (PW) and continuous wave (CW) mode operations:
    • 3- or 5-level ±100 V output waveform
    • Programmable ±200 mA or ±400 mA or ±600 mA or
      ±800 mA source and sink current in 3-level
      configuration (±400 mA or ±200 mA in 5-level
      configuration)
  • Fully integrated 23 Ω resistance real clamping-to-ground function
  • Fully integrated 23 Ω resistance transmitting/receiving switches (TR_SW)
    • Compliant with receiver multiplexing
      function
  • Auxiliary integrated circuits
    • Noise-blocking diodes
    • Thermal protection
    • Undervoltage protection and bias supply
      checks
  • Programmable power management to optimize the performances for ultra-portable applications
  • Beamforming in transmission mode
    • Programmable single-channel delay for beam
      steering and focusing
    • Clock frequency up to 200 MHz
    • 5 ns delay resolution
    • From 5 ns to 20 us delay range @ 200 MHz
    • 3 us minimum delay table writing time
  • Embedded memory to store transmission patterns
    • 32 states for waveform definition, with
      waveform compression algorithm
    • Up to 4 different waveforms for each channel
  • Easy driving control
    • Control through standard Quad Serial
      Peripheral Interface (QSPI)
    • Few input signals to drive several devices
    • Single interrupt as alert signal
    • Single trigger to manage transmitting (TX) and
      receiving (RX) phases, fully automatic and
      programmable
    • Anti-glitch on TRIGGER signal during TX
      phase
  • Checksum control
  • Very low package thermal resistance
  • Latch-up free due to HV SOI technology
  • Just a few passive components needed
  • Small package: BGA 11.5 mm x 10.5 mm x 1.35 mm with 168 balls and 0.8 mm pitch