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STM32H745XGH6

High-performance and DSP with DP-FPU, Arm Cortex-M7 + Cortex-M4 MCU with 1MBytes of Flash memory, 1MB RAM, 480 MHz CPU, Art Accelerator, L1 cache, external memory interface, large set of peripherals, SMPS

Supply Voltage Min Volt1.62
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M4
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameTFBGA 240+25 14x14x1.2 P 0.8 mm

STM32H745xI/G devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision...
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Key features
  • Dual core
    • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator™) for internal Flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 2 Mbytes of Flash memory with read-while-write support
    • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
    • Dual mode Quad-SPI memory interface running up to 133 MHz
    • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 125 MHz in Synchronous mode
    • CRC calculation unit
  • Security
    • ROP, PC-ROP, active tamper
  • General-purpose input/outputs
    • Up to 168 I/O ports with interrupt capability
  • Reset and power management
    • 3 separate power domains which can be independently clock-gated or switched off:
      • D1: high-performance capabilities
      • D2: communication peripherals and timers
      • D3: reset/clock control/power management
    • 1.62 to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
    • Embedded regulator (LDO) to supply the digital circuitry
    • High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
    • Voltage scaling in Run and Stop mode (6 configurable ranges)
    • Backup regulator (~0.9 V)
    • Voltage reference for analog peripheral/VREF+
In stock
Quantity $ per unit Savings
1-9$19.200%
10-24$17.718%
25-99$16.9212%
100-249$15.1221%
250-499$14.4325%
500-713$13.7328%
714-10000$12.9433%
Contact sales
$19.20
$19.20
Supply Voltage Min Volt1.62
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M4
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameTFBGA 240+25 14x14x1.2 P 0.8 mm

STM32H745xI/G devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision...
Read More

Key features
  • Dual core
    • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator™) for internal Flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 2 Mbytes of Flash memory with read-while-write support
    • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
    • Dual mode Quad-SPI memory interface running up to 133 MHz
    • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 125 MHz in Synchronous mode
    • CRC calculation unit
  • Security
    • ROP, PC-ROP, active tamper
  • General-purpose input/outputs
    • Up to 168 I/O ports with interrupt capability
  • Reset and power management
    • 3 separate power domains which can be independently clock-gated or switched off:
      • D1: high-performance capabilities
      • D2: communication peripherals and timers
      • D3: reset/clock control/power management
    • 1.62 to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
    • Embedded regulator (LDO) to supply the digital circuitry
    • High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
    • Voltage scaling in Run and Stop mode (6 configurable ranges)
    • Backup regulator (~0.9 V)
    • Voltage reference for analog peripheral/VREF+